Packaging

Device packaging refers to the final stage of fabrication, where the chip (or die) is encased in a protective shell to safeguard it from physical damage and environmental factors. This process also facilitates the electrical connections between the semiconductor and the external circuitry:

  • Die Bonder

  • Wire Bonder

  • Inert Glove Box

  • Cleanroom/ Tent

  • Wafer Dicer

  • Wafer Polisher

  • Wafer Grinder

  • Solder Reflow 

  • MEMS Packaging