Packaging
Device packaging refers to the final stage of fabrication, where the chip (or die) is encased in a protective shell to safeguard it from physical damage and environmental factors. This process also facilitates the electrical connections between the semiconductor and the external circuitry:
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Die Bonder
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Wire Bonder
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Inert Glove Box
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Cleanroom/ Tent
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Wafer Dicer
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Wafer Polisher
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Wafer Grinder
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Solder Reflow
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MEMS Packaging