Reflow Solder Systems

Reflow Solder Systems are used in reflow solder processes (flux or fluxless) for R&D, prototyping and small series production.
The reflow solder system is perfect for the following applications:

  • flux-less soldering
  • flip chip process
  • adhesive bonding
  • solder bump reflowing
  • encapsulation of housings
  • soldering of power devices
  • heat treatment of semiconductor wafers
  • prototype development
  • quality control

We offer a wide range of reflow solder systems:

  • RSO: Reflow Solder Oven RSO-200 (up to 650 °C)
  • RSS: Mini Reflow Solder System RSS-110-S, RSS-160-S, RSS-210-S (max. temp. 400 °C)
  • RVS-210: Reflow Vacuum Solder System up to 400 °C also for flux
  • VSS: Vacuum Solder System (up to 400 °C) also for flux

Reflow Solder Systems

RSS-110-S Vacuum Reflow Solder System
RSS-110-S Vacuum Reflow Solder System
$POR
The Unitemp Germany RSS-110-S Reflow Solder System is a very compact and easy to use tool for the...
RSS-160-S Vacuum Reflow Solder System
RSS-160-S Vacuum Reflow Solder System
$POR
The RSS-160-S Reflow Solder System is a very compact and easy useable tool for the use in laboratories...
RSS 3X210-S Vacuum Reflow Solder System
RSS 3X210-S Vacuum Reflow Solder System
$POR
Reflow Solder System for serial production The RSS-3X210-S Reflow Solder System is a very compact and easy useable...
RSS-210-S Vacuum Reflow Solder System
RSS-210-S Vacuum Reflow Solder System
$POR
The RSS-210-S Reflow Solder System is a very compact and easy useable tool for the use in laboratories...
RSS-210 Vacuum Reflow Solder System
RSS-210 Vacuum Reflow Solder System
$POR
The RSS-210 Reflow Solder System is a very compact and easy useable tool for the use in laboratories...
VSS-450-300 Vacuum Reflow Solder System
VSS-450-300 Vacuum Reflow Solder System
$POR
Vacuum Reflow Solder Oven for up to 300 x 300 mm substrate size and temperature up to 450...
RSO-200 Vacuum Reflow Solder System
RSO-200 Vacuum Reflow Solder System
$POR
Reflow Solder OvenTechnical Data RSO-200: Loading area (max. part size): 200x170x40mm (WxDxH) Quartz glass process chamber (fix mounted),...
RSO-200-HV Vacuum Reflow Solder System
RSO-200-HV Vacuum Reflow Solder System
$POR
Reflow Solder OvenTechnical Data RSO-200: Loading area (max. part size): 200x170x40mm (WxDxH) Quartz glass process chamber (fix mounted),...
RSS-110-S Vacuum Reflow Solder System
RSS-110-S Vacuum Reflow Solder System
$POR
RSS-160-S Vacuum Reflow Solder System
RSS-160-S Vacuum Reflow Solder System
$POR
RSS 3X210-S Vacuum Reflow Solder System
RSS 3X210-S Vacuum Reflow Solder System
$POR
RSS-210-S Vacuum Reflow Solder System
RSS-210-S Vacuum Reflow Solder System
$POR
RSS-210 Vacuum Reflow Solder System
RSS-210 Vacuum Reflow Solder System
$POR
VSS-450-300 Vacuum Reflow Solder System
VSS-450-300 Vacuum Reflow Solder System
$POR
RSO-200 Vacuum Reflow Solder System
RSO-200 Vacuum Reflow Solder System
$POR
RSO-200-HV Vacuum Reflow Solder System
RSO-200-HV Vacuum Reflow Solder System
$POR
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