Reflow Solder Systems

Reflow Solder Systems are used in reflow solder processes (flux or fluxless) for R&D, prototyping and small series production.
The reflow solder system is perfect for the following applications:

• flux-less soldering
• flip chip process
• adhesive bonding
• solder bump reflowing
• encapsulation of housings
• soldering of power devices
• heat treatment of semiconductor wafers
• prototype development
• quality control

We offer a wide range of reflow solder systems:

• RSO: Reflow Solder Oven RSO-200 (up to 650 °C)
• RSS: Mini Reflow Solder System RSS-110-S, RSS-160-S, RSS-210-S (max. temp. 400 °C)
• RVS-210: Reflow Vacuum Solder System up to 400 °C also for flux
• VSS: Vacuum Solder System (up to 400 °C) also for flux