Reflow Solder Systems

8 products

Reflow Solder Systems are used in reflow solder processes (flux or fluxless) for R&D, prototyping and small series production.
The reflow solder system is perfect for the following applications:

flux-less soldering
flip chip process
adhesive bonding
solder bump reflowing
encapsulation of housings
soldering of power devices
heat treatment of semiconductor wafers
prototype development
quality control

We offer a wide range of reflow solder systems:

RSO: Reflow Solder Oven RSO-200 (up to 650 °C)
RSS: Mini Reflow Solder System RSS-110-S, RSS-160-S, RSS-210-S (max. temp. 400 °C)
RVS-210: Reflow Vacuum Solder System up to 400 °C also for flux
VSS: Vacuum Solder System (up to 400 °C) also for flux