Reflow Solder Systems

Reflow Solder Systems are used in reflow solder processes (flux or fluxless) for R&D, prototyping and small series production.
The reflow solder system is perfect for the following applications:

  • flux-less soldering
  • flip chip process
  • adhesive bonding
  • solder bump reflowing
  • encapsulation of housings
  • soldering of power devices
  • heat treatment of semiconductor wafers
  • prototype development
  • quality control

We offer a wide range of reflow solder systems:

  • RSO: Reflow Solder Oven RSO-200 (up to 650 °C)
  • RSS: Mini Reflow Solder System RSS-110-S, RSS-160-S, RSS-210-S (max. temp. 400 °C)
  • RVS-210: Reflow Vacuum Solder System up to 400 °C also for flux
  • VSS: Vacuum Solder System (up to 400 °C) also for flux

Reflow Solder Systems

The Unitemp Germany RSS-110-S Reflow Solder System is a very compact and easy to use tool for the...
The RSS-160-S Reflow Solder System is a very compact and easy useable tool for the use in laboratories...
Reflow Solder System for serial production The RSS-3X210-S Reflow Solder System is a very compact and easy useable...
The RSS-210-S Reflow Solder System is a very compact and easy useable tool for the use in laboratories...
The RSS-210 Reflow Solder System is a very compact and easy useable tool for the use in laboratories...
Vacuum Reflow Solder Oven for up to 300 x 300 mm substrate size and temperature up to 450...
Reflow Solder OvenTechnical Data RSO-200: Loading area (max. part size): 200x170x40mm (WxDxH) Quartz glass process chamber (fix mounted),...
Reflow Solder OvenTechnical Data RSO-200: Loading area (max. part size): 200x170x40mm (WxDxH) Quartz glass process chamber (fix mounted),...
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