Rapid Thermal Annealing Ovens

High precision Rapid Thermal Annealer (RTA) or Rapid Thermal Processor (RTP) Ovens are used for several applications including annealing of silicon and compound semiconductor wafers or devices, Rapid Thermal Oxidation (RTO), Rapid Thermal Nitridation (RTN), Rapid Thermal Diffusion from spin-on dopant, Crystallization, contact alloying and more.

Our RTPs can reach up to 1200C with a maximum ramp rate of 150K/s down to 10E-6 mbar/hPa with a maximum substrate size of 156 x 156mm or 150mm diameter (depending on model).

Rapid Thermal Annealing Ovens

Rapid Thermal Vacuum Process Oven with ramp-up rate up to 150 K/sec. Key features are good temperature uniformity precisely...
High Vacuum Rapid Thermal Vacuum Process Oven with ramp-up rate up to 150 K/sec. Key features are good temperature...
Rapid Thermal Vacuum Process Oven with ramp up rate up to 75 K/sec.Key features are good temperature uniformity...
Rapid Thermal Vacuum Process Oven with ramp up rate up to 150 K/sec.Key features are good temperature uniformity...
High vacuum compliant Rapid Thermal Process Oven with ramp up rate up to 75 K/sec. Key features are...
Vacuum Process Oven for up to 300 x 300 mm substrate size and temperature up to 1000 °CLamp...
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