Wire & Die Bonders

TPT Wire Bonder is an owner-managed company that develops and manufactures semi-automatic wire bonder with over 30 years of experience in wire bonding technology. Their bonders stand out with intuitive operation, innovation an optimal performance. They have been successfully selling bonders to more than 40 countries worldwide and have partners in many countries that provide technical support and service. Their customers include the world's leading companies and universities.

Hesse GmbH is one of the world’s leading producers of fully automated Wedge-Wedge Wire Bonders.

Hesse GmbH develops and manufactures fully automatic ultrasonic bonding and welding machines as well as laser welding systems. Software for monitoring the bond-processes and customized tools and machines complete the portfolio.

All relevant industrial companies engaged in assembly and connection technology (semiconductor manufacturers, HF/RF, automotive, battery systems supplier, medical etc.) are among the worldwide customers of Hesse GmbH. 

The core competencies of the company are mechatronic systems, ultrasonic technology, control engineering and in particular the detailed knowledge of the processes and physical effects relevant in ultrasonic bonding technology. In order to maintain and expand technological leadership, they conduct intensive research and development in all aforementioned areas. There are international co-operations with universities and research institutes. Development goals include simple and wear-free constructions with highly integrated functionality and the integration of intelligent systems for achieving fault-free processes such as the patented process integrated quality control (PiQC) which records and evaluates quality-relevant parameters in real time.