The HB16 is a bench top size wire bonder, ideal for laboratories and pilot production lines. One bond head for bonding in ball/wedge or wedge/wedge bonding mode. Only a tool change is necessary. Z- & Y-Axis is automatic/motorised.
Easy operation with a TFT touch screen, direct access and simple adjustment of all bond parameters.
Full specifications can be found here
Gold, aluminium, silver & copper wire
Wire sizes from 17um to 75um. Ribbon sizes up to 25 x 250um
6.5" Touch Panel
6.5" Touch Panel provides easy intuitive control
Automatic bond height adjustment
Z-axis sensor identifies touch down & sets the height parameters
Motorised Wire Clamp
Precise tail length control
Wedge, ball & ribbon bonding
Easy to switch between bonding modes
Storage of 100 parameters
Easy setting recall for working on different applications
Motorised Wire Spool
For consistent looping
Extension kit compatibility
Pick & Place, Pull Tester, Video Targeting and Copper Ball Bonding
Repeatable Loop Profiles
Motorised axis allows precise loop repetition
Simple Loop Programming
Create individual loop profiles consisting or up to 10 steps
Deep & wide access
Ample workspace due to the special bond head design
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