Etching Systems

Etching systems are used to selectively remove or etch materials on a nano/atomic level. Oxford Instruments & Moorfield Nanotechnology manufacture a range of etching tools for various applications. Techniques include:

  • Reactive Ion Etch (RIE)
  • Inductively Coupled Plasma Reactive Ion Etch (ICP-RIE)
  • Deep Silicon Etch
  • BOSCH Process Si Etch
  • Ion Beam Etch (IBE)
  • Atomic Layer Etch (ALE) 

Etching Systems

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Ion beam etch offers maximum flexibility coupled with excellent uniformity and is suitable for a wide range of...
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The PlasmaPro 100 range of etch and deposition tools can be fitted with a variety of substrate electrodes,...
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The PlasmaPro 100 Estrelas platform is designed to give total flexibility for Deep Silicon Etch (DSiE) applications -...
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The PlasmaPro 800 offers a flexible solution for reactive ion etching (RIE) processes on large wafer batches and...
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The PlasmaPro 100 RIE modules deliver anisotropic dry etching for an extensive range of processes. Compatible with all...
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The PlasmaPro 80 reactive ion etch (RIE) is a compact, small footprint system offering versatile etch and deposition...
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An evolution in single wafer etch technology. With extensive experience of etching materials such as GaN, SiC and...
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The PlasmaPro 100 range of etch and deposition tools can be fitted with a variety of substrate electrodes,...
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The PlasmaPro 80 ICP is a compact, small footprint system offering versatile ICP etch solutions with convenient open...
The nanoETCH implements Moorfield's unique soft-etching technology and provides the fine etching control crucial for graphene and 2D...
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