μMLA The Table-Top Maskless Aligner

μMLA The Table-Top Maskless Aligner-Nano Vacuum Australia and New Zealand

μMLA The Table-Top Maskless Aligner

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CONFIGURABLE AND COMPACT TABLETOP MASKLESS ALIGNER WITH RASTER SCAN AND VECTOR EXPOSURE MODULES

The table-top µMLA system is state-of-the-art in maskless technology built on the renowned µPG platform – the most sold tabletop maskless system worldwide. It is a perfect entry-level research and development (R&D) tool for virtually any application requiring microstructures. Typical examples are microfluidics (cell sorting devices, lab-on-a-chip), small-scale mask-writing, micro-optic and microlens arrays, sensors, MEMS, contacting 2D materials and fanning out electrodes, etc.

µMLA is flexible and customizable. Users can choose between types of exposure modules. The Raster Module is used for fast exposure independent of design complexity. The Vector Module is designed for patterning continuous smooth curves such as waveguides in a faster and more accurate way. Three optical setups offer a choice of variable resolution and throughput. Each allows easy switching between different resolution and speed configurations to optimize exposure for a given application. Draw Mode enables straightforward ad-hoc modifications to existing structures and electrical contacts to nanowires or 2D materials. With its small footprint, µMLA fits on a regular table.

Direct-write Lithography

No mask-related costs, effort, or security risks

Exposure Quality

Edge roughness raster mode 100 nm; vector mode 30 nm; CD uniformity 200 nm

Exposure Speed

4” wafer in 90 minutes

Small Footprint

63x80x53 cm / 25”x32”x21” – the smallest tabletop maskless lithography too

Flexible Configuration

Choice of exposure wavelength; a choice of raster and vector scan modules

Flexible Use

Software enables easy switching for variable resolution and throughput speeds

User-friendly

Intuitive software and tool operation, easy handling of small samples

Plug-and-play Setup

Raster Scan Exposure Mode

Fast with excellent image quality and fidelity, write time is independent of structure size or pattern density. LED light source at 365 or 390 nm

Vector Scan Exposure Mode

Patterning continuous structures consisting of curved lines – where smooth contours are required. Laser light source 405 nm and/or 375 nm

3 Optical Setups

Min. resolution of 0.6 µm, 1 µm and 3 µm; variable resolution within each mode

Optional Overview Camera

Fast and easy location of alignment marks or other features of interest on substrate

Glovebox Integration

MBraun glovebox for patterning of sensitive materials in a controlled Nitrogen environment

Draw Mode

Import and overlay of .bmp files on top of the real-time microscope image — as in a virtual mask aligner; simple lines and shapes can be drawn into the real-time camera image for immediate exposure

Optical Autofocus

Perfect exposure of small samples (less than 10 mm)

Exposure Area

Can be upgraded from 100 x 100 mm to 150 x 150 mm

Choice of Exposure, Wavelength and Source

Raster Scan Mode: LED light source at 365 or 390 nm. Vector Scan Mode: laser light source 405 nm and/or 375 nm



Writing performance (both Raster Scan and Vector Exposure Module) Write Mode I* Write Mode II* Write Mode III*
Minimum structure size [μm] 0.6 1 3
Minimum lines and spaces [half pitch, μm] 0.8 1.5 3
2nd layer alignment over 5 x 5 mm² [3σ, nm] 500 500 1000
2nd layer alignment over 50 x 50 mm² [3σ, nm] 1000 1000 2000
Writing performance with the Raster Scan Exposure Module
CD uniformity [3σ, nm] 200 300 400
Max. write speed [mm²/min] 10 30 130
10 mm²/min at 0.6 µm 30 mm²/min at 1 µm 130 mm²/min** at 3 µm
Write speed with optional “Variable Resolution for Raster Scan Exposure Module” (UMVAR) for different minimum structure sizes 20 mm²/min at 1 µm 60 mm²/min at 2 µm 160 mm²/min** at 4 µm
25 mm²/min at 2 µm 90 mm²/min at 4 µm 300 mm²/min** at 6 µm
Writing performance with the Vector Exposure Module
Address grid in vector mode [nm] 20
Edge roughness [3σ, nm] 30 50 100
Maximum linear write speed 200 mm/s
System specifications
Maximum substrate size 6″ x 6″
Minimum substrate size 5 mm x 5 mm
Substrate thickness 0.1 to 12 mm
Maximum write area 150 mm x 150 mm

Raster scan exposure module Vector exposure module
Light source LED; 390 nm or 365 nm Laser; 405 nm and/or 375 nm
System dimensions (lithography unit)
µMLA Width x Depth Height x Weight
Main system housing 630 mm (25″) x 800 mm (31.5″) 530 mm (21″) x 100 kg (220 lbs)
Optional antivibrational table plus user PC table 1400 mm (55″) x 700 mm (28″) 750 mm (30″) x 350 kg (770 lbs)
Installation requirements
Electrical 230 VAC ± 5%, 50/60 Hz, 16A
Compressed air 6 - 10 bar, stability ± 0.5 bar
* Only one write mode can be installed on the system
** With standard 390 nm LED

Please note
Specifications depend on individual process conditions and may vary according to equipment configuration. Write speed depends on pixel size and write mode. Design and specifications are subject to change without prior notice

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