RSS 3X210-S Vacuum Reflow Solder System
Unitemp Germany
SKU: RSS 3X210-S
Reflow Solder System for serial production
The RSS-3X210-S Reflow Solder System is a very compact and easy useable tool for the use in laboratories and clean rooms as table top unit. The chamber is vacuum sealed and equipped with a viewing window. This allows the view control of the soldering process. The unit is equipped with a Mass Flow Controller as standard for the process gas.
The reflow solder system is perfect for the following applications:
- flux-less soldering
- flip chip process
- adhesive bonding
- solder bump reflowing
- soldering of power devices
- heat treatment of semiconductor wafers
- prototype development
- quality control
Technical Data:
- heated area: 3 heated plates with each 210 mm x 210 mm
- chamber height: 40 mm (optional up to 80 mm)
- Mass Flow controller for Nitrogen (5 nlm)
- vacuum atmosphere up to 10exp.-3 hPa (KF16 connector)
- temperature up to 300 °C (higher on request)
- ramp up rate: better 120 K/minute
- ramp down rate: better 60 K/minute
- SIMATIC© process control with 50 programs and 50 steps each
- 7" touch panel
- water cooled chamber (controlled and watched)
- electrical connection type: 3x 230V,3P, +N, 18 kW
Datasheet Download
Model RSS-3X210 Serial Production Solder Reflow System
Options and accessories
| FA I | Formic acid module (separate module, not integrated) with Mass Flow Controller |
| FA II | integrated formic acid module with Mass Flow Controller |
| FA III | integrated formic acid module with shared Mass Flow Controller |
| MFC | additional Mass Flow Controller (max. 2 pcs) |
| RSS-EH | Chamber height 80mm instead of 40mm |
| RSS-H2 | Hydrogen Module: for using 100% Hydrogen incl. gas line with Mass Flow Controller |
| RSS-H2S | Safety device to prevent uncontrolled emission of Hydrogen |
| RSS-IL | Interlock mechanism during operation |
| Lift Pins | Lift pin option for Wafer up and down movement |
| RSS-TC | Additional thermocouple (max. 3 pc) |
| VAC I | Basic Vacuum up to 3 hPa, incl. vacuum sensor and valve, excl. pump |
| VAC II | Comfort Vacuum up to 10E-3 hPa, incl, vacuum sensor and valve, excl. pump |
| MP | Membrane/Diaphragm pump for vacuum up to 3 hPa |
| MPC | Chemical resistant membrane pump for vacuum up to 3 hPa |
| RVP | Rotary vane pump for vacuum up to 10E-3 hPa with oilfilter |
| WC II | Closed loop water cooling system |
