RSS 3X210-S Vacuum Reflow Solder System

Brand: Unitemp Germany

Product Code: RSS 3X210-S

Availability: On Request

Reflow Solder System for serial production

The RSS-3X210-S Reflow Solder System is a very compact and easy useable tool for the use in laboratories and clean rooms as table top unit. The chamber is vacuum sealed and equipped with a viewing window. This allows the view control of the soldering process. The unit is equipped with a Mass Flow Controller as standard for the process gas.

The reflow solder system is perfect for the following applications:

  • flux-less soldering
  • flip chip process
  • adhesive bonding
  • solder bump reflowing
  • soldering of power devices
  • heat treatment of semiconductor wafers
  • prototype development
  • quality control

Technical Data:

  • heated area: 3 heated plates with each 210 mm x 210 mm
  • chamber height: 40 mm (optional up to 80 mm)
  • Mass Flow controller for Nitrogen (5 nlm)
  • vacuum atmosphere up to 10exp.-3 hPa (KF16 connector)
  • temperature up to 300 °C (higher on request)
  • ramp up rate:      better 120 K/minute
  • ramp down rate:  better 60 K/minute
  • SIMATIC© process control with 50 programs and 50 steps each
  • 7" touch panel
  • water cooled chamber (controlled and watched)
  • electrical connection type: 3x 230V,3P, +N, 18 kW

      Datasheet Download

      Model RSS-3X210 Serial Production Solder Reflow System

      Options and accessories

      FA I Formic acid module (separate module, not integrated) with Mass Flow Controller
      FA II integrated formic acid module with Mass Flow Controller
      FA III integrated formic acid module with shared Mass Flow Controller
      MFC additional Mass Flow Controller (max. 2 pcs)
      RSS-EH Chamber height 80mm instead of 40mm
      RSS-H2 Hydrogen Module: for using 100% Hydrogen incl. gas line with Mass Flow Controller
      RSS-H2S Safety device to prevent uncontrolled emission of Hydrogen
      RSS-IL Interlock mechanism during operation
      Lift Pins Lift pin option for Wafer up and down movement
      RSS-TC Additional thermocouple (max. 3 pc)
      VAC I Basic Vacuum up to 3 hPa, incl. vacuum sensor and valve, excl. pump
      VAC II Comfort Vacuum up to 10E-3 hPa, incl, vacuum sensor and valve, excl. pump
      MP Membrane/Diaphragm pump for vacuum up to 3 hPa
      MPC Chemical resistant membrane pump for vacuum up to 3 hPa
      RVP Rotary vane pump for vacuum up to 10E-3 hPa with oilfilter
      WC II Closed loop water cooling system