Advanced Sub-Micron Bonder
The FINEPLACER® sigma combines sub-micron placement accuracy with a 450 x 150 mm working area and bonding forces up to 1000 N.
The system is ideal for all types of precision die bonding and flip chip applications at chip and wafer level. This includes complex 2.5D and 3D IC packages, Focal Plane Arrays (i.e. image sensors), MEMS/MOEMS, and more.
Placing small devices on large substrates is made possible by the FPXvisionTM optical system design. With this alignment system, the smallest structures at the highest magnification can be viewed across the entire field of view. Moreover, FPXvisionTM introduces pattern recognition to a die bonder with manual alignment.
The FINEPLACER® sigma embraces all features of an assembly and development platform capable of handling an unlimited spectrum of applications and prepared for future technologies.
Key Facts
- Large bonding area
- Reproducible sub-micron placement accuracy
- Pattern recognition for software verified alignment
- Wide range of supported component sizes
- UHD vision alignment system with FPXvisionTM
- Modular machine platform allows in-field retrofitting during entire service life
- Wide range of component presentation (wafer, waffle pack, gel-pak®)
- Synchronized control of all process related parameters
- Process module compatibility across Finetech platforms
- Individual configurations with process modules
- Ultra low bonding force
- Data/media logging and reporting function
- Wide range of controlled bonding forces
- In-situ process observation in HD
- Full process access & easy visual programming with touch screen interface
- Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
- 3-color LED illumination
- Sequence control with predefined parameters
*depending on configuration
Download the brochure here
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