Automatic Multi-Purpose Bonder
The FINEPLACER® femtoblu is an automated micro assembly cell with a placement accuracy of 2.0 µm @ 3 Sigma and ultra-low bonding force capability for photonic applications.
Designed for prototyping and high-yield production duties, this die attach system supports all bonding technologies specifically required for the assembly of photonic and optoelectronic components. A complete machine enclosure minimizes external influences to ensure a stable process environment and protects the operator against gas, vapor and UV radiation.
The DualCam visual alignment system with twin-camera module and beam splitter provides application-specific fields of view, digital zoom, various LED illumination options as well as optics shifting along the X-axis for optimal view of a wide spectrum of component sizes.
IPM Command, the advanced FINEPLACER® operating software specifically developed for a wide spectrum of die bonding tasks, supports a consistent, ergonomic and clearly structured process development. It enables the synchronized control of all process parameters and additional process modules and provides pattern recognition for the automated alignment of substrates and components based on their structures and patterns.
Depending on the requirements, the modular FINEPLACER® femtoblu can be individually configured and upgraded in-field to support additional applications and technologies in the field of photonics. It covers the entire die bonding workflow of inspection, characterization, packaging, final test and qualification in the development and manufacturing of data communication products and beyond.
Key Facts
- Placement accuracy of 2 µm @ 3 Sigma
- Multi-chip capability
- Excellent price performance ratio
- Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
- Dual-camera system for alignment
- Modular machine platform allows in-field retrofitting during entire service life
- Ultra low bonding force
- Wide range of component presentation (wafer, waffle pack, gel-pak®)
- Large bonding area
- Process module compatibility across Finetech platforms
- Individual configurations with process modules
- Automatic tool management
- Various bonding technologies in one recipe
- Wide range of supported component sizes
- Overlay vision alignment system (VAS) with fixed beam splitter
- In-situ process observation in HD
- Full process access and easy programming
- Data/media logging and reporting function
- Synchronized control of all process related parameters
- Process and material traceability via TCP (for MES)
- Integrated scrubbing function
- Fully automatic and manual operation
*depending on configuration
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