Sub-Micron Table Top Die Bonder
The table top flip chip bonder FINEPLACER® lambda 2 builds on its acclaimed predecessor to set new standards in precision die attach and advanced chip packaging for opto-electronic assemblies and more.
The completely revised table top die bonding platform can be easily configured for a wide range of applications for process development or prototyping. Numerous process module options and in-field-retrofit capabilities guarantee maximum technological flexibility of the table top die bonder to protect your investment in the face of ever-changing challenges.
Due to the table top flip chip bonder’s ergonomic machine design and software-supported user guidance, the user remains at the center of action. Powerful optical systems allow the user to keep an overview at all times, even when working in the sub-micron range.
The table top die bonder FINEPLACER® lambda 2 shares a common module range and innovative operating software with Finetech’s automatic die bonding systems to ensure a seamless process migration to series production. Ask us about our scalable solutions.
Key Facts
- Sub-micron placement accuracy
- Superior optical resolution
- Excellent price performance ratio
- Manual or semi-automatic machine versions
- Individual configurations with process modules
- Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
- Data/media logging and reporting function
- Wide range of controlled bonding forces
- Full process access & easy visual programming with touch screen interface
- Various bonding technologies in one recipe
- Process module compatibility across Finetech platforms
- In-situ process observation in HD
- Modular machine platform allows in-field retrofitting during entire service life
- Synchronized control of all process related parameters
- Overlay vision alignment system (VAS) with fixed beam splitter
- Sequence control with predefined parameters
*depending on configuration
Download the brochure here
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