VPG 300 DI
VPG 300 DI
VPG 300 DI
VPG 300 DI
VPG 300 DI
VPG 300 DI
VPG 300 DI
VPG 300 DI
VPG 300 DI
VPG 300 DI
VPG 300 DI
VPG 300 DI
VPG 300 DI
VPG 300 DI

VPG 300 DI

Heidelberg Instruments
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THE MASKLESS DIRECT IMAGER FOR HIGH-ACCURACY AND HIGH-RESOLUTION MICROSTRUCTURES

The VPG 300 DI is a Volume Pattern Generator specially designed for direct writing high-resolution microstructures in i-line resists. Derived from the mask making tool, it features all advanced VPG+ system components to be able to write with the highest precision and accuracy. The maximum write area covers a 300 mm wafer.

The target usage of the VPG 300 DI system is primarily in academic and industrial research and development, where high flexibility and features smaller than 2 µm are required. This system caters to the needs of various applications, including product prototyping, MEMS, mix and match with other tools, and writing of structures with quasi-stitching-less unlimited die sizes. The VPG 300 DI performance is comparable to a mask-based i-line stepper that is traditionally used for these applications, while providing the advantages of a maskless patterning technology.
Similar to the VPG+, the VPG 300 DI is based on the same field-proven ultra-high-speed exposure optical engine. However, it goes a step further by incorporating additional advanced system components such as a Zerodur® stage, differential interferometer, and various options for metrology, alignment, and wafer handling.

This combination of performance, technological benefits, and components makes the VPG 300 DI an ideal choice for researchers and developers seeking precise and efficient microstructure fabrication capabilities.

TECHNICAL DATA

Write mode I II
Writing performance
Minimum feature size [µm] 0.5 0.8
Minimum lines and spaces [µm] 0.8 1.2
Address Grid [nm] 4 8
Edge roughness [3σ, nm] 30 40
CD uniformity [3σ, nm] 50 60
2nd layer alignment (global) [nm] 100 130
Write speed [mm2/min] 340* 1020*
*Fast mode: 680 and 2056 mm2/min with similar performance, but without specification
Exposure time for 100 x 100 mm2 area [min] 39 17

System features
Light source High-power DPSS laser with 355 nm
Maximum substrate size and write area 300 x 300 mm2
Substrate thickness 0 to 12 mm (other thicknesses on request)
Maximum exposure area 300 x 300 mm2
Autofocus Realtime autofocus system (optical and pneumatic)
Autofocus compensation range Up to 80 µm
Flowbox (Closed-loop) temperature controlled environmental chamber
Alignment and metrology Camera system and software package for metrology and alignment
Other features and options Full automatic handling and prealigning of 100, 150, 200, and 300 mm wafers. Optical edge detection, topside alignment and optional IR and backside alignment. Zerodur® stage and high-resolution differential interferometer
System dimensions
System / Electronic rack
Width [mm] 2605 / 800
Depth [mm] 1652 / 650
Height [mm] 2102 / 1800
Weight [kg] 3550 / 180
Installation requirements
Electrical 400 VAC ± 5 %, 50/60 Hz, 16 A, 3 phases
Compressed air 6 - 10 bar

Please note
Specifications depend on individual process conditions and may vary according to equipment configuration. Write speed depends on pixel size and write mode. Design and specifications are subject to change without prior notice.

 Download the Fact Sheet Here.

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