VARIXX 806 (Ø200mm) with 6 process modules
- Flexible configuration of processing modules
- Available modules: spin coater, developer, temperature and smart-EBR
- Handling thin, standard or bonded wafer (Si, glass & others)
- Round wafer up to Ø300 mm (Ø12 inch)
- Square substrates size up to 230 x 230 mm (9 x 9 inch)
Optional sub-systems; wafer flipper, PR dispense system (pumps, syringe, CPD) and media supply cabinets with various canister designs.
Designed to be used in applications: SPIN (SPRAY) COATING, DEVELOPING, BAKING & COOLING AND EBR