RSS-210 Vacuum Reflow Solder System

Brand: Unitemp Germany

Product Code: RVS-210

Availability: On Request

The RSS-210 Reflow Solder System is a very compact and easy useable tool for the use in laboratories and clean rooms as tabletop unit. The chamber is vacuum sealed and equipped with a viewing window. This allows the view control of the soldering process. The unit is equipped with a Mass Flow Controller as standard for the process gas.

The reflow solder system is perfect for the following applications:

  • soldering with flux and with other contaminating material
  • flip chip process
  • adhesive bonding
  • solder bump reflowing
  • encapsulation of housings
  • soldering of power devices
  • heat treatment of semiconductor wafers
  • prototype development
  • quality control

    Technical Data:

    • heated area: 210 mm x 210 mm
    • chamber height: 50 mm (optional up to 80 mm)
    • viewing window with 60 mm dia.
    • Mass Flow controller for Nitrogen (5 nlm)
    • vacuum atmosphere up to 10exp.-3 hPa (KF16 connector)
    • temperature up to 400 °C (optional up to 500 °C)
    • ramp up rate:      better 120 K/minute
    • ramp down rate:  better 120 K/minute
    • SIMATIC© process control with 50 programs and 50 steps each
    • 7" touch panel
    • water cooled chamber (controlled and watched)
    • electrical connection type: 230V, 9 kW or 115V, 7 kW

          Datasheet Download

          Model RVS-210 Reflow Solder System Datasheet

          Options and accessories

          FA I Formic acid module (separate module, not integrated) with Mass Flow Controller
          FA II integrated formic acid module with Mass Flow Controller
          FA III integrated formic acid module with shared Mass Flow Controller
          MFC additional Mass Flow Controller (max. 2 pcs)
          RSS-EH Chamber height 80mm instead of 40mm
          RSS-H2 Hydrogen Module: for using 100% Hydrogen incl. gas line with Mass Flow Controller
          RSS-H2S Safety device to prevent uncontrolled emission of Hydrogen
          RSS-IL Interlock mechanism during operation
          RSS-TC Additional thermocouple (max. 2 pc)
          VAC I Basic Vacuum up to 3 hPa, incl. vacuum sensor and valve, excl. pump
          VAC II Comfort Vacuum up to 10E-3 hPa, incl, vacuum sensor and valve, excl. pump
          MP Membrane/Diaphragm pump for vacuum up to 3 hPa
          MPC Chemical resistant membrane pump for vacuum up to 3 hPa
          RVP Rotary vane pump for vacuum up to 10E-3 hPa with oilfilter
          WC I Closed loop water cooling system