The RSS-160-S Reflow Solder System is a very compact and easy useable tool for the use in laboratories and clean rooms as table top unit. The chamber is vacuum sealed and equipped with a viewing window. This allows the view control of the soldering process. The unit is equipped with a Mass Flow Controller as standard for the process gas.
The reflow solder system is perfect for the following applications:
- flux-less soldering
 - flip chip process
 - adhesive bonding
 - solder bump reflowing
 - encapsulation of housings
 - soldering of power devices
 - heat treatment of semiconductor wafers
 - prototype development
 - quality control
 
Technical Data:
- heated area: 160 mm x 160 mm (= model RSS-110-S)
 - chamber height: 40 mm (optional up to 80 mm)
 - viewing window with 60 mm dia.
 - Mass Flow controller for Nitrogen (5 nlm)
 - vacuum atmosphere up to 10exp.-3 hPa (KF16 connector)
 - temperature up to 400 °C (optional up to 500 °C)
 - ramp up rate: better 100 K/minute
 - ramp down rate: better 100 K/minute
 - SIMATIC© process control with 50 programs and 50 steps each
 - 7" touch panel
 - water cooled chamber (controlled and watched)
 - electrical connection type: 230V, 2.4 kW or 115V, 1.2 kW
 
Datasheet Download
Model RSS-Series (RSS-110-S, RSS-160-S & RSS-210-S)
Reflow Solder Systems & Ovens Model Comparision 
Options and accessories
| FA I | Formic acid module (separate module, not integrated) with Mass Flow Controller | 
| FA II | integrated formic acid module with Mass Flow Controller | 
| FA III | integrated formic acid module with shared Mass Flow Controller | 
| MFC | additional Mass Flow Controller (max. 2 pcs) | 
| RSS-EH | Chamber height 80mm instead of 40mm | 
| RSS-H2 | Hydrogen Module: for using 100% Hydrogen incl. gas line with Mass Flow Controller | 
| RSS-H2S | Safety device to prevent uncontrolled emission of Hydrogen | 
| RSS-IL | Interlock mechanism during operation | 
| RSS-TC | Additional thermocouple (max. 2 pc) | 
| VAC I | Basic Vacuum up to 3 hPa, incl. vacuum sensor and valve, excl. pump | 
| VAC II | Comfort Vacuum up to 10E-3 hPa, incl, vacuum sensor and valve, excl. pump | 
| MP | Membrane/Diaphagm pump for vacuum up to 3 hPa | 
| MPC | Chemical resistant membrane pump for vacuum up to 3 hPa | 
| RVP | Rotary vane pump for vacuum up to 10E-3 hPa with oilfilter | 
| WC I | Closed loop water cooling system | 
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