RSO-200-HV Vacuum Reflow Solder System

Brand: Unitemp Germany

Product Code: RSO-200-HV

Availability: On Request

Reflow Solder OvenTechnical Data RSO-200:

  • Loading area (max. part size): 200x170x40mm (WxDxH)
  • Quartz glass process chamber (fix mounted), incl. graphite susceptor
  • with integrated gas- in- and outlet
  • 1 Mass Flow Controller für Nitrogen 5 nlm is standard
  • heated by 12 Infrared lamps ( 9kW)
  • bottom heating
  • vacuum up to 10E-6 hPa (Turbomolecular and vacuum measurement included, rough pump on request)
  • SPS controller, SIMATIC
  • 50 programs with 50 steps each storable
  • 7" Touch Panel for comfortable programming and process control   
  • Ethernet interface
  • Max. Temperature: 650 °C
  • Ramp up rate: better 10 K/Sec
    Ramp down rate: T=600°C to 400°C max. 200 K/min
    T=400°C to 100°C max. 30K/min
  • Temperature control by thermocouple
  • Cooling: Water cooling required (option)
  • Electrical connection: CEE 16 A (3x230V, 3 Phase, +N, +PE)
  • Weight: about 65 kg
  • Dimension: 505mm x 504mm x 580mm

        Datasheet Download

        Model RS0-200-HV Solder Reflow Oven Datasheet

        Options and accessories

        RSO-200  Basic unit
        RSO-GT  Graphite tray with cover
        RSO-MFC  Additonal gas line with mass flow controller (max. 4 gas lines)
        MP  Membrane pump for vacuum up to 10 mbar with manometer
        MPC Chemcial Membrane pump for vacuum up to 10 mbar with manometer
        RVP Rotary vane pump for vacuum with oil filter up 10exp3 hPa
        RSO-FA Formic Acid Option
        RSO-H2 Module for using 100% Hydrogen including one mass flow controller
        RSO-H2S Safety device to prevent uncontrolled emission of Hydrogen
        RSO-PC-200 add. 200mm oven chamber ("double-chamber oven")
        RSO-TC add. thermocouple for measure on device (plugged in chamber)
        WC III Closed loop water cooling system (stand-alone)