Reflow Solder OvenTechnical Data RSO-200:
- Loading area (max. part size): 200x170x40mm (WxDxH)
- Quartz glass process chamber (fix mounted), incl. graphite susceptor
- with integrated gas- in- and outlet
- 1 Mass Flow Controller für Nitrogen 5 nlm is standard
- heated by 12 Infrared lamps ( 9kW)
- bottom heating
- vacuum up to 10E-6 hPa (Turbomolecular and vacuum measurement included, rough pump on request)
- SPS controller, SIMATIC
- 50 programs with 50 steps each storable
- 7" Touch Panel for comfortable programming and process control
- Ethernet interface
- Max. Temperature: 650 °C
- Ramp up rate: better 10 K/Sec
Ramp down rate: T=600°C to 400°C max. 200 K/min
T=400°C to 100°C max. 30K/min - Temperature control by thermocouple
- Cooling: Water cooling required (option)
- Electrical connection: CEE 16 A (3x230V, 3 Phase, +N, +PE)
- Weight: about 65 kg
- Dimension: 505mm x 504mm x 580mm
Datasheet Download
Model RS0-200-HV Solder Reflow Oven Datasheet
Options and accessories
| RSO-200 | Basic unit |
| RSO-GT | Graphite tray with cover |
| RSO-MFC | Additonal gas line with mass flow controller (max. 4 gas lines) |
| MP | Membrane pump for vacuum up to 10 mbar with manometer |
| MPC | Chemcial Membrane pump for vacuum up to 10 mbar with manometer |
| RVP | Rotary vane pump for vacuum with oil filter up 10exp3 hPa |
| RSO-FA | Formic Acid Option |
| RSO-H2 | Module for using 100% Hydrogen including one mass flow controller |
| RSO-H2S | Safety device to prevent uncontrolled emission of Hydrogen |
| RSO-PC-200 | add. 200mm oven chamber ("double-chamber oven") |
| RSO-TC | add. thermocouple for measure on device (plugged in chamber) |
| WC III | Closed loop water cooling system (stand-alone) |
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