PlasmaPro 800 RIE

Brand: Oxford Instruments

Product Code: PlasmaPro100PolarisICP

Availability: On Request

The PlasmaPro 800 offers a flexible solution for reactive ion etching (RIE) processes on large wafer batches and 300mm wafers, in a compact footprint, open-loading system. The large wafer platen allows for production scale batch processing and 300mm wafer handling.

  • High performance processes
  • Excellent substrate temperature control
  • Precise process control
  • Proven processes for 300mm single wafer Failure Analysis
  • High performance processes
  • Excellent substrate temperature control
  • Precise process control

      System Features:

      Allowing maximum process flexibility for compound semiconductor, optoelectronics, and photonics applications, the PlasmaPro 800 provides:

      Large electrode - Low Cost of Ownership

      Etch end point detection - Reliability and serviceability

      Endpoint detection by laser interferometry and/or optical emission spectroscopy - Can be fitted to enhance etch control

      Options of a 4-, 8- or 12-line gas pod - Provides flexibility in processes and process gases, and may be remotely sited in the service area, away from the main process tool

      Close-coupled turbo pump - High pumping speed and excellent base pressure

      Datalogging - Traceability and history of chamber and process conditions

      Fluid-cooled and/or electrically-heated electrodes - Excellent electrode temperature control and stability

      Applications:

      • Failure analysis dry etch de-processing using our specially configured failure analysis tools, with RIE and dual-mode
      • RIE/PE processes ranging from packaged chip and die etch through to full 300mm wafer etch
      • High quality PECVD of SiNx and SiO2 for photonics, dielectric layer passivation and many other applications
      • SiO2, SiNx and quartz etch
      • Metal and polyimide etch
      • Passivation deposition for high brightness LED production
      • III-V etch processes