PlasmaPro 800 PECVD

Brand: Oxford Instruments

Product Code: PlasmaPro100PECVD

Availability: On Request

The PlasmaPro 800 offers a flexible solution for reactive ion etching (RIE) processes on large wafer batches and 300mm wafers, in a compact footprint, open-loading system. The large wafer platen allows for production scale batch processing and 300mm wafer handling.

  • High performance processes
  • Excellent substrate temperature control
  • Precise process control
  • Proven processes for 300mm single wafer Failure Analysis
  • High performance processes
  • Excellent substrate temperature control
  • Precise process control

        System Features:

        Allowing maximum process flexibility for compound semiconductor, optoelectronics, and photonics applications, the PlasmaPro 800 provides:

        Large electrode - Low Cost of Ownership

        Etch end point detection - Reliability and serviceability

        Endpoint detection by laser interferometry and/or optical emission spectroscopy - Can be fitted to enhance etch control

        Options of a 4-, 8- or 12-line gas pod - Provides flexibility in processes and process gases, and may be remotely sited in the service area, away from the main process tool

        Close-coupled turbo pump - High pumping speed and excellent base pressure

        Datalogging - Traceability and history of chamber and process conditions

        Fluid-cooled and/or electrically-heated electrodes - Excellent electrode temperature control and stability

        Applications:

        • Failure analysis dry etch de-processing using our specially configured failure analysis tools, with RIE and dual-mode
        • RIE/PE processes ranging from packaged chip and die etch through to full 300mm wafer etch
        • High quality PECVD of SiNx and SiO2 for photonics, dielectric layer passivation and many other applications
        • SiO2, SiNx and quartz etch
        • Metal and polyimide etch
        • Passivation deposition for high brightness LED production
        • III-V etch processes