MLA300 Maskless Aligner for Volume Production

Brand: Heidelberg Instruments

Product Code: MLA300

Availability:Out of stock

The MLA300 is the industrial production version of the Maskless Aligner, which already has become a standard in Research & Development applications, rapid prototyping, and low-to mid-volume production. The MLA300 achieves high resolutions of 2 µm lines and spaces at the high throughput and high availability expected in production. It features full automation with wafer robot and load ports, and software specifically designed for the production environment to offer a simplified automated workflow.

At the same time, it features all the advantages associated with maskless lithography: Overheads and expense associated with the procurement of masks, and their handling, cleaning, and storage are eliminated.

The Maskless Aligner technology uses a Spatial Light Modulator which essentially acts like a dynamic mask. It offers the flexibility to structure the most challenging substrates, allowing per-die pattern corrections (e.g. to react to distortions or process variations), and employs a real-time autofocus to follow substrate warp or corrugations. The fully integrated exposure modules are available for a selection of wavelengths (375 nm or 405 nm) and with different resolution options. Multiple exposure modules can be mounted in the MLA300 for even higher throughput.

The MLA300 excels in application areas such as the production of sensors, sensor ICs, MEMS devices, discrete electronic components, analog and digital ICs, ASICs, Power electronics, OLED displays, as well as for advanced packaging applications.

For additional information please download the Fact Sheet or contact us at Nano Vacuum Australia & New Zealand.

Key Features

  • Maximum exposure area: 300 mm x 300 mm
  • Minimum feature size: 1.5 μm
  • Minimum lines and spaces: 2 µm
  • Maximum write speed: 5000 mm2/min (at 405 nm, with one module)
  • Real-time autofocus
  • Overview camera for fast alignment and inspection
  • Front- and backside alignment
  • Temperature-controlled environmental chamber
  • Exposure wavelengths: 405 nm and / or 375 nm