- 3D Metrology
- Lithography - Direct Write
- Leak Detectors
- MEMS High Vacuum Sealers
- Portable Cleanrooms
- Rapid Thermal Annealing Ovens
- Reflow Solder Systems
- Residual Gas Analyzer
- Solvent Purification
- Surface Science
- Thin Film Materials
- Wire & Die Bonders
- THz-TDS Characterisation
MLA150 Direct Write Maskless Aligner
The Maskless Aligner MLA150 – now also in a high-resolution version
Our Maskless Aligner series was first introduced in 2015. Since then, the revolutionary, state-of-the-art maskless technology has become firmly established. Today, the MLA150 Maskless Aligner serves as a trusted, indispensable workhorse in many multiuser facilities, nanofabrication labs, and national institutes.
NEW developments in the MLA line
The MLA line has now been expanded to include a high-resolution version of the MLA150: This allows the patterning of structures down to a 600 nm feature size and provides all the advantages of the established MLA150: In addition to flexibility and economy, MLA150 provides non-contact exposure, outstanding ease of use, and high speed, making it the ideal tool in rapid prototyping environments, for low- to mid-volume production, and Research & Development.
We constantly strive to add even more advanced features to the popular Maskless Aligner MLA150. We can now offer the optional High Aspect Ratio Mode to optimize sidewalls in thick photoresists, as well as the Advanced Field Alignment Mode which may even further improve the alignment accuracy by performing automated field-by-field alignment on individual dies.
Maskless Aligner Technology
The maskless photolithography process eliminates the need for a photomask, as the system exposes the pattern directly onto the resist-covered surface. Should design changes be required, these can be quickly implemented by changing the CAD layout. This saves money as well as time and provides extreme adaptability, allowing you to react fast and independently to new situations, requirements, or potential errors.
Exposing an area of 100 x 100 mm² with structures as small as 1 micron will take less than 10 minutes – independent of the fill factor or number of structures within this area. Alignment in multi-layer applications is achieved within less than a minute by using the integrated cameras with varying resolution. Layer to layer alignment accuracy is better than 500 nm and does not depend on the operator’s level of training.
The application areas of MLA150 include life sciences, MEMS, micro-optics, semiconductors, sensors, actuators, MOEMS, material research, nano-tubes, graphene, and any other application that requires microstructures.
For additional information please download the Fact Sheet or contact us at Nano Vacuum Australia & New Zealand.
- Substrates up to 9" x 9"
- Standard version: Structures down to 1 µm
- High-resolution version: Structures down to 600 nm
- Exposure area of 150 x 150 mm² (200 x 200mm2 optional)
- Non-contact exposure
- Light source at 405 nm and 375 nm
- SLM based light engine
- Multiple data input formats
- Alignment accuracy of 500 nm
- Backside alignment
- Realtime autofocus
- Resist database
- Automatic labeling and serialization