MLA150 Direct Write Maskless Aligner

Brand: Heidelberg Instruments

Product Code: MLA150

Availability: On Request

The Maskless Aligner MLA150 – now also in a high-resolution version

Our Maskless Aligner series was first introduced in 2015. Since then, the revolutionary, state-of-the-art maskless technology has become firmly established. Today, the MLA150 Maskless Aligner serves as a trusted, indispensable workhorse in many multiuser facilities, nanofabrication labs, and national institutes.

NEW developments in the MLA line

The MLA line has now been expanded to include a high-resolution version of the MLA150: This allows the patterning of structures down to a 600 nm feature size and provides all the advantages of the established MLA150: In addition to flexibility and economy, MLA150 provides non-contact exposure, outstanding ease of use, and high speed, making it the ideal tool in rapid prototyping environments, for low- to mid-volume production, and Research & Development.

We constantly strive to add even more advanced features to the popular Maskless Aligner MLA150. We can now offer the optional High Aspect Ratio Mode to optimize sidewalls in thick photoresists, as well as the Advanced Field Alignment Mode which may even further improve the alignment accuracy by performing automated field-by-field alignment on individual dies.

Maskless Aligner Technology

The maskless photolithography process eliminates the need for a photomask, as the system exposes the pattern directly onto the resist-covered surface. Should design changes be required, these can be quickly implemented by changing the CAD layout. This saves money as well as time and provides extreme adaptability, allowing you to react fast and independently to new situations, requirements, or potential errors.

Exposing an area of 100 x 100 mm² with structures as small as 1 micron will take less than 10 minutes – independent of the fill factor or number of structures within this area. Alignment in multi-layer applications is achieved within less than a minute by using the integrated cameras with varying resolution. Layer to layer alignment accuracy is better than 500 nm and does not depend on the operator’s level of training.

The application areas of MLA150 include life sciencesMEMSmicro-opticssemiconductors, sensors, actuators, MOEMS, material research, nano-tubes, graphene, and any other application that requires microstructures.

For additional information please download the Fact Sheet or contact us at Nano Vacuum Australia & New Zealand.

Key Features

  • Minimum substrate size: 3 mm x 3 mm
  • Maximum exposure area: 6” x 6” (optional 8”x 8”)
  • Minimum structure size down to 0.6 μm
  • Maximum write speed: 1400 mm2/min at 1 μm feature size
  • Real-time autofocus
  • Overview camera for fast alignment and inspection
  • Front- and backside alignment
  • Temperature-controlled environmental chamber
  • Exposure wavelengths: 405 nm and / or 375 nm
  • Draw Mode for CAD-less exposure
  • Standard Grayscale Exposure Mode
  • High-Aspect Ratio Mode
  • Easy-to-use operating software