HB75 Semiautomatic Die Bonder

The HB75 is a bench top size diebonder, ideal for laboratories and pilot production lines. It is equipped with a double head for die-placement and for epoxy. The epoxy can be dispensed through epoxy stamping or epoxy dispensing. Motorised Z-Axis with true 90 degrees linear movement enables semiautomatic operation.
The work holder grips the substrate with vacuum, has two die carrier holders and an integrated spot heater. The heating curve can be programmed on a special controller.
Different pick-up holders allow the usage of all kinds of tool diameters.
The machine can be easily tailored towards your die-bonding needs.

Full specifications can be found here

Pick & Place
Pick Mircochip from Die-Carrier and place it on your surface

Rotation Bondhead
for quick change between tools

Full HD Camera
High-resolution camera and optical zoom

Angle Alignment
Microchip alignment through the rotatable work plate

Epoxy Dispensing
Simple and precise handling

Inspection
Visual inspection of microassembly for example from soldering. bonding or flip chip

X-Y Micrometer screws
Exact placement from Die, stamp or dispenser

Auto Vacuum Pump
Integrated vacuum pump, turns on automatically at Pick & Place

Epoxy Stamping
Fast and precise stamping process

True vertical Z Movement
Motorized Z-axis with 90-degree linear movement

Camera Angles
Free changeable camera angle with optical zoom for precise verification

Optional heater stage
Up to 450C heat, with programmable heating cycles