HB75 Semiautomatic Die Bonder
The HB75 is a bench top size diebonder, ideal for laboratories and pilot production lines. It is equipped with a double head for die-placement and for epoxy. The epoxy can be dispensed through epoxy stamping or epoxy dispensing. Motorised Z-Axis with true 90 degrees linear movement enables semiautomatic operation.
The work holder grips the substrate with vacuum, has two die carrier holders and an integrated spot heater. The heating curve can be programmed on a special controller.
Different pick-up holders allow the usage of all kinds of tool diameters.
The machine can be easily tailored towards your die-bonding needs.
Pick & Place
Pick Mircochip from Die-Carrier and place it on your surface
for quick change between tools
Full HD Camera
High-resolution camera and optical zoom
Microchip alignment through the rotatable work plate
Simple and precise handling
Visual inspection of microassembly for example from soldering. bonding or flip chip
X-Y Micrometer screws
Exact placement from Die, stamp or dispenser
Auto Vacuum Pump
Integrated vacuum pump, turns on automatically at Pick & Place
Fast and precise stamping process
True vertical Z Movement
Motorized Z-axis with 90-degree linear movement
Free changeable camera angle with optical zoom for precise verification
Optional heater stage
Up to 450C heat, with programmable heating cycles