HB16 Auto Z- & Y-Axis Thermosonic Wire Bonder - Wedge & Ball Bonding

Brand: TPT

Product Code: HB16

Availability: On Request

The HB16 is a bench top size wire bonder, ideal for laboratories and pilot production lines. One bond head for bonding in ball/wedge or wedge/wedge bonding mode. Only a tool change is necessary. Z- & Y-Axis is automatic/motorised.
Easy operation with a TFT touch screen, direct access and simple adjustment of all bond parameters.

Full specifications can be found here

Gold, aluminium, silver & copper wire
Wire sizes from 17um to 75um. Ribbon sizes up to 25 x 250um

6.5" Touch Panel
6.5" Touch Panel provides easy intuitive control

Automatic bond height adjustment
Z-axis sensor identifies touch down & sets the height parameters

Motorised Wire Clamp
Precise tail length control

Wedge, ball & ribbon bonding
Easy to switch between bonding modes

Storage of 100 parameters
Easy setting recall for working on different applications

Motorised Wire Spool
For consistent looping

Extension kit compatibility
Pick & Place, Pull Tester, Video Targeting and Copper Ball Bonding

Repeatable Loop Profiles
Motorised axis allows precise loop repetition

Simple Loop Programming
Create individual loop profiles consisting or up to 10 steps

Deep & wide access
Ample workspace due to the special bond head design