HB100 Automatic Thermosonic Wire Bonder - Wedge & Ball Bonding
The HB100 is a new generation of automatic desktop wire bonders. It is suited for laboratories and small volume production lines. One bond head for bonding in ball/wedge or wedge/wedge bonding mode. Z- X- & Y-Axis are fully automatic/motorised. The HB100 is very easy to handle with the touchscreen and joystick. The intuitive software guides the user through processes and bond assist features. The bonding technology is based on our popular semi-automatic bonders.
It is completely engineered and manufactured in Germany.
Gold, aluminium, silver & copper wire
Wire sizes from 17um to 75um. Ribbon sizes up to 25 x 250um
21" Touch Panel
21" Touch Panel provides easy intuitive control
Automatic wire bonder
Motorised Z-X-Y Axis & Bondhead rotation
Wedge, ball & ribbon bonding
One bondhead. Easy to switch between bonding modes
Simple Loop Programming
Create individual loop profiles consisting or up to 10 steps
Deep & wide access
Ample workspace due to the special bridge design