The HB05 is a bench top size wire bonder, ideal for laboratories and pilot production lines. One bond head for bonding in ball/wedge or wedge/wedge bonding mode. Only a tool change is necessary.
Easy operation with a TFT display, direct access and simple adjustment of all bond parameters.
Full specifications can be found here
Gold, aluminium, silver & copper wire
Wire sizes from 17um to 75um. Ribbon sizes up to 25 x 250um
4" TFT display with push dial
Fast and easy control of all bonding parameters
Motorised Wire Clamp
Precise tail length control
Wedge, ball & ribbon bonding
Easy to switch between bonding modes
Storage of 20 parameters
Easy setting recall for working on different applications
Extension kit compatibility
Pick & Place, Pull Tester, Video Targeting and Copper Ball Bonding
Compact design & intuitive control
The bonder's practical design ensures smooth and easy use
Deep & wide access
Ample workspace due to the special bond head design
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