DFP8141 Fully Automatic Polisher
CMP polisher designed to process hard-to-process materials such as sapphire and SiC
- Φ200 mm
- 1 axis, 2 chuck tables
- Wafer Thinning
- Stress Releaf
Fully automatic operation
The DFP8141 is a fully automatic polisher which performs CMP processing from cassette to cassette. With the installation of a cleaning station, wafer cleaning and drying after processing are performed automatically.
For small workpieces made of difficult-to-process materials
The DFP8141 supports CMP for materials such as sapphire, SiC, LT, and LN.
A transfer system which supports three workpiece configurations
The transfer system accepts three workpiece configurations: single wafer transfer, substrate transfer, and frame transfer.
|Supported workpiece size||-||Φ8 inch|
|Polishing wheel||-||Φ300 mm CMP pad|
|Rotation speed range||min‐1||500 ～ 2,000|
|Equipment dimensions (W x D x H)||mm||900 x 2,584 x 2,000|
*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.