DFD6450 Fully Automatic Dicing Saw

DFD6450 Fully Automatic Dicing Saw

DFD6450 Fully Automatic Dicing Saw

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Fully automatic dicing saw with parallel dual spindles

  • Φ200 mm
  • Parallel dual spindle
  • Package Singulation

A parallel dual design unique to DISCO

Featuring parallel dual-spindles, DFD6450 inherits the basic concept of the existing model, DFD651, and has been added to the DFD6000 series lineup with superior usability and processing quality. Designed to handle a wide range of dicing and grooving applications, the DFD6450 processes silicon, compound semiconductor wafers, ceramics and other materials used for electronic component applications. In addition, the DFD6450 also processes glass and other materials used for optical component applications.The DFD6450's parallel dual spindle design is unique to DISCO and offers several benefits. As the spindles are supported from the rear of the machine, they are easily accessible from the front for blade changes and other maintenance work. The design also supports specialized applications such as mounting multiple blades on each spindle for package singulation.

Improved usability

The 15-inch LCD touch panel with GUI (Graphical User Interface) allows for easy and intuitive operation. In addition, a spindle shaft-lock feature that automatically secures the spindle axis has been installed to make blade replacement quick and easy. DFD6450 also has a cutting water flow rate control feature, making it possible to set the cutting water flow rate for each set of device data.

Control screen
Control screen

Spindle lineup

A range of spindles supports diverse workpieces and applications.

  • [Standard]
    1.0 kW air spindle
    (uses 2" blades, rated torque: 0.16 N·m).
  • [Options]
    1.0 kW air spindle with higher torque
    (uses 2" blades, rated torque: 0.24 N·m)
    2.2 kW air spindle
    (uses 3" blades, rated torque: 0.7N·m)

Advanced options

The equipment can have a transformer, UPS, CO2 injector, or booster pump unit built-in by revising the equipment layout while maintaining an equipment footprint equal to that of the existing model. In addition, an atomizing nozzle mechanism (Japan patent no. 3410385) for the spinner section with high cleaning effect on workpieces and ionizer specifications for preventing electrostatic build up during workpiece transfer can be selected.

DFD6450 Operation flow

  1. Lower arm moves the workpiece from the cassette to the pre-alignment stage. Lower arm moves the workpiece to the chuck table → cutting 
  2. Upper arm moves the workpiece to the spinner table → cleaning and drying 
  3. Lower arm returns the workpiece to the cassette


Specification Unit 1.0 kW 2.2 kW
Max. workpiece size - Φ8 inch
X-axis Cutting range mm 250
Cutting speed mm/s 0.1 ~ 600
Y1-axis Cutting range mm 250
Index step mm 0.0001
Positioning accuracy mm Within 0.003/250
(Single error) Within 0.002/5
Y2-axis Cutting range mm 30
Index step mm 0.0001
Positioning accuracy mm Within 0.002/30
Z-axis Max. stroke mm 35.2
Moving resolution mm 0.00005
Repeatability accuracy mm 0.001
θ-axis Max. rotating angle deg 380
Spindle Rated output kW 1.0
Rated torque N・m 0.16,
0.24 (higher torque)
Rotation speed range min-1 6,000 ~ 60,000、
3,000 ~ 40,000 (higher torque)
3,000 ~ 30,000
Equipment dimensions(W×D×H) mm 1,120 x 1,500 x 1,600
Equipment weight kg Approx. 1,400

*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.

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