DAG810 Automatic Surface Grinder
Automatic grinder to respond to new processing needs
- Φ200 mm
- 1 axis, 1 chuck table
Simple and compact single-axis grinder
The DAG810 is a compact, automatic grinder for workpieces up to 8" in diameter. It has one spindle and one chuck table and is designed to process a variety of materials.
Equipment dimensions: 600 (W) x 1,700 (D) x 1,780 (H) mm
Adoption of high-rigidity, low-vibration spindle provides superior grinding results and is capable of in-feed grinding and creep feed grinding (user-specified specification).
Process hard or brittle substrates of various diameters with ease. The DAG810 is also the choice for processing a wide variety of electronic components.
Installation of a touch screen and GUI (Graphical User Interface) provides improved operability. In addition, processing and equipment status are displayed on-screen and each operation can be performed just by touching the icons.
Special options for a variety of needs
- Height gauge
One or two-probe height gauge (option)
- In-feed grinding
Workpieces up to Φ300 mm (option)
- Frame grinding
8" frame grinding (option)
- Creep-feed grinding
Workpieces up to Φ200 mm (user-specified spec.)
- Processes silicon and compound semiconductors for analysis.
- Grinds resin for CSP and WL-CSP
- Improves the planarity of lithium tantalate and lithium niobate
- Processes green ceramics and sapphire
|Supported workpiece size||-||Φ8 inch
(Φ4, 5, 6, 8 inch with universal chuck table use)
|Grinding Method||-||Anomalous In-feed grinding with wafer rotation|
|Grinding Wheels||-||Φ200 mm Diamond Wheel|
|Rotation speed range||min‐1||1,000 ～ 7,000|
|Equipment dimensions (W × D × H)||mm||600 × 1,700 × 1,780|
*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.