DAG810 Automatic Surface Grinder

DAG810 Automatic Surface Grinder

DAG810 Automatic Surface Grinder

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Automatic grinder to respond to new processing needs

  • Φ200 mm
  • 1 axis, 1 chuck table

Simple and compact single-axis grinder

The DAG810 is a compact, automatic grinder for workpieces up to 8" in diameter. It has one spindle and one chuck table and is designed to process a variety of materials.

Space-saving design

Equipment dimensions: 600 (W) x 1,700 (D) x 1,780 (H) mm

Precision grinding

Adoption of high-rigidity, low-vibration spindle provides superior grinding results and is capable of in-feed grinding and creep feed grinding (user-specified specification).

Unlimited materials

Process hard or brittle substrates of various diameters with ease. The DAG810 is also the choice for processing a wide variety of electronic components.

Easy operation

Installation of a touch screen and GUI (Graphical User Interface) provides improved operability. In addition, processing and equipment status are displayed on-screen and each operation can be performed just by touching the icons.


Special options for a variety of needs

  • Height gauge
    One or two-probe height gauge (option)
  • In-feed grinding
    Workpieces up to Φ300 mm (option)
  • Frame grinding
     8" frame grinding (option)
  • Creep-feed grinding
    Workpieces up to Φ200 mm (user-specified spec.)

High-precision applications

  • Processes silicon and compound semiconductors for analysis.
  • Grinds resin for CSP and WL-CSP
  • Improves the planarity of lithium tantalate and lithium niobate
  • Processes green ceramics and sapphire


Specification Unit
Supported workpiece size - Φ8 inch
(Φ4, 5, 6, 8 inch with universal chuck table use)
Grinding Method - Anomalous In-feed grinding with wafer rotation
Grinding Wheels - Φ200 mm Diamond Wheel
Spindle Rated output kW 4.2
Rated torque N・m 5.9
Rotation speed range min‐1 1,000 ~ 7,000
Equipment dimensions (W × D × H) mm 600 × 1,700 × 1,780
Equipment weight kg Approx.1,300

*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.

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