DAD3351 Automatic Dicing Saw

DAD3351 Automatic Dicing Saw

DAD3351 Automatic Dicing Saw

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Highly expandability to support various processing needs

  • Φ200 mm
  • Single spindle

Supports a wide range of applications

DAD3351 is a semi automatic dicing saw compatible with Φ8-inch workpieces. Includes a high output 1.8 kW spindle as standard. Also, using a high torque, high rigidity 2.2 kW spindle (optional), difficult-to-process materials including silicon and ceramics can be processed. Through a user-specified specification, blades up to Φ5 inches can be used for processing. As a result, it is possible to process workpieces with thicknesses of 10 mm or more. Supports blades up to Φ5 inches with user-specified specification. In addition, the multi-alignment function is available as an option.

Stable processing quality

Adopted high bridge-type frame structure and moved the spindle support structure forward to minimize the effects of thermal expansion and vibration, providing a more stable processing point. In addition, a spindle temperature sensor was installed for temperature monitoring.

Processing Time Reduction

Processing time is decreased up to 5% compared to the existing equipment through axis-speed improvement by adopting servo motors for all axes and optimizing the control parameters.

Improved functions and operation

The high-speed, high-accuracy NCS (Non-Contact Setup, optional) reduces blade height measurement time for the processing table by 74%. Further processing quality stabilization is achieved through improved measurement accuracy. In addition, the visibility during kerf check was improved by enabling microscope ring light three-channel switching. This model supports SECS/GEM.

Ring light three-channel switching specification
Ring light three-channel switching specification

Easy operation

  • XIS (Extended Interface System)
    Operation buttons consolidated on microscope screens
  • Wafer mapping
    Graphic processing condition display similar to full automation equipment
  • Log viewer
    Graphic analog data display and equipment data visualization
  • Help viewer
    Displays instructions when error occurs for quick, accurate recovery.
>Wafer mapping
Wafer mapping
Log viewer
Log viewer
Help viewer
Help viewer

High maintainability

  • Enhancement of Dust Prevention Performance on X-, Y-, and Z-axes.
    Effective for materials including ceramics where contamination is likely to damage the shaft.


Specification Unit 1.8 kW 2.2 kW (Option) 2.2 kW (Option)
(High torque)
Max. workpiece size - Φ8 inch (250 mm × 250 mm user-specified specification)
X axis Cutting range mm 260
Cutting speed mm/s 0.1 ~ 1,000
Y-axis Cutting range mm 260
Index step mm 0.0001
Index positioning accuracy mm 0.002/260
(Single error) 0.002/5
Z-axis Max. stroke mm 31.2 31.4
Moving resolution mm 0.0000002 (0.2 nm)
Repeatability accuracy mm 0.001
θ-axis Max. rotating angle deg 320
Θ axis rotation specification 380°(option):382.5
Spindle Rated output 1.8 at 60,000 min-1 2.2 at 30,000 min-1 2.2 at 15,000 min-1
Rated torque N・m 0.29 0.7 1.4
Rotation speed range min‐1 6,000 ~ 60,000 3,000 ~ 30,000 3,000 ~ 15,000
Equipment dimensions(W×D×H) mm 880 × 1,000 × 1,800
Equipment weight kg Approx. 1,100

*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.

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