DAD3231 Automatic Dicing Saw

DAD3231 Automatic Dicing Saw

DAD3231 Automatic Dicing Saw

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Evolved Compact Dicing Saw

  • Φ150 mm
  • Single spindle

Focus on Functionality and Expandability

DAD3231, designed for high performance and expandability, just like the conventional DAD3230, satisfies a wide range of needs, including electronic component materials such as glasses and ceramics. Because the equipment layout was designed with additional space, DAD3231 can support workpieces up to 6 x 6 inches as an option. This makes flexible processing of user-specified workpieces possible. A linear scale can be installed on the Y-axis as an option when high-accuracy processing is required.

Compatible with Diverse Small Workpiece Processing Needs

DAD3231 has a smaller footprint compared to existing equipment. The axis speed is accelerated and throughput is improved by adopting servo motors for all axes. In addition, this model uses PC electric components as standard and supports communication control as an option. Because image recognition functions, such as auto alignment, auto focus, auto kerf check, are installed as a standard specification, it is possible to minimize operator labor costs. A 2.0 kW high-torque spindle is installed as a standard specification.

Improved functions and operation

The high-speed, high-accuracy NCS (Non-Contact Setup, optional) reduces blade height measurement time for the processing table by 74%. Further processing quality stabilization is achieved through improved measurement accuracy. In addition, the visibility during kerf check was improved by enabling microscope ring light three-channel switching. This model supports SECS/GEM.

Ring light three-channel switching specification

Ease of operation

  • XIS (Extended Interface System)
    Operation buttons are consolidated on the microscope screen.
  • Wafer mapping
    The processing status is displayed visually in the same way as fully automatic equipment.
  • Log viewer
    Analog data is displayed in a graph and equipment data is more easily visualized.
  • Help viewer
    Troubleshooting is displayed when an error occurs to achieve quick and accurate recovery support.
  • Automatic alignment, Autofocus, Automatic kerf check
Wafer mapping
Log viewer
Help viewer


Specification Unit
Max. workpiece size - Φ6 inch (150 mm × 150 mm optional accsessory)
X-axis Cutting range mm 210
Cutting speed mm/s 0.1 ~ 800
Y-axis Cutting range mm 162
Index step mm 0.0001
Index positioning accuracy mm 0.005/185
(Single error) 0.003/5
Y-axis scale (option)
(Single error) 0.001/5
Z-axis Max. stroke mm 31.2(Φ2 inch blades)
Moving resolution mm 0.000002
Repeatability accuracy mm 0.001
θ-axis Max. rotating angle deg 320
Spindle Layout - Single
Rated output kW 2.0 at 40,000 min-1
Rated torque N・m 0.48
Rotation speed range min-1 3,000 ~ 40,000
Equipment dimensions(W × D × H) mm 650 × 950 × 1,670
Equipment weight kg Approx. 550

*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.

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