DAD3221 Automatic Dicing Saw

DAD3221 Automatic Dicing Saw

DAD3221 Automatic Dicing Saw

Your inquiry was submitted successfully. You can expect to hear from us shortly.

Evolved Compact Dicing Saw

  • Φ150 mm
  • Single spindle

Compatible with Diverse Small Workpiece Processing Needs

DAD3221 is a single-axis dicing saw which achieves processing of workpieces up to Φ6 inches as a standard, and 150 x 150 mm with a user-specified specification. Has the world’s smallest footprint* (width: 490 mm x depth: 870 mm) through the small footprint design. A 2.0 kW high-torque spindle is installed as a standard specification and a high-rotation 1.8 kW spindle is available as an option.

*Investigated by DISCO

High Productivity

Software operation speed and response speed are improved through adoption of a high performance MCU. The axis speed is accelerated and throughput is improved by adopting servo motors for all axes. In addition, this model uses PC electric components as standard and supports communication control as an option. Because image recognition functions, such as auto alignment, auto focus, auto kerf check, are installed as a standard specification, it is possible to minimize operator labor costs.

Improved functions and operation

The high-speed, high-accuracy NCS (Non-Contact Setup, optional) reduces blade height measurement time for the processing table by 74%. Further processing quality stabilization is achieved through improved measurement accuracy. In addition, the visibility during kerf check was improved by enabling microscope ring light three-channel switching. This model supports SECS/GEM.

Ring light three-channel switching specification

Ease of operation

  • XIS (Extended Interface System)
    Operation buttons are consolidated on the microscope screen.
  • Wafer mapping
    The processing status is displayed visually in the same way as fully automatic equipment.
  • Log viewer
    Analog data is displayed in a graph and equipment data is more easily visualized.
  • Help viewer
    Troubleshooting is displayed when an error occurs to achieve quick and accurate recovery support.
  • Automatic alignment, Autofocus, Automatic kerf check
Wafer mapping
Log viewer
Help viewer


Specification Unit 2.0 kW 1.8 kW (option)
Max. workpiece size - Φ6 inch (150 mm × 150mm user-specified specification)
X-axis Cutting range mm 160
Cutting speed mm/s 0.1~800
Y-axis Cutting range mm 162
Index step mm 0.0001
Index positioning accuracy mm 0.005/160
(Single error) 0.003/5
Y-axis scale (option)
(Single error) 0.001/5
Z-axis Max. stroke mm 32.2(Φ2 inch blades)
Moving resolution mm 0.000002
Repeatability accuracy mm 0.001
θ-axis Max. rotating angle deg 320
Spindle Layout - Single
Rated output kW 2.0 at 40,000 min-1 1.8 at 60,000 min-1
Rated torque N・m 0.48 0.29
Rotation speed range min-1 3,000 ~ 40,000 6,000 ~ 60,000
Equipment dimensions(W × D × H) mm 490 × 870 × 1,670
Equipment weight kg Approx. 420

*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

You may also like

More from DISCO

Recently viewed