The Bondjet BJ931 is an ultrasonic wedge bonder developed especially for maxtrix leadframe applications. The application of two bondheads enables to bond two different wire sizes as well as a combination of wire and ribbon.
The fully automatic dual-head leadframe wedge bonder Bondjet BJ931 meets the latest technology and flexibility demands for automotive and power electronics applications; handling heavy aluminum, copper wire and ribbon on two specialized bondheads that can be exchanged.

Your benefits:

• Robust, clean design
• Low maintenance requirements
• User-friendly software
• Service support functions
• Industry-leading PiQC™ process monitoring system

Features and Process Advantages

• Precisely programmable bondforce actuator
• Wear-free components with Piezo technology
• Maintenance-free solid state joints
• Integrated, non destructive pulltest for wire and ribbon
• Automated bondforce calibration
• Pattern recognition time: 6 ms – 8 ms (search region: 512 × 512 pixels, pattern: 64 × 64 pixels)
• Rapid image capture with new digital image processing and flash light illumination
• E-Box: patented solution for optimized tool change and programmable alignment marks for cutter, wire guide and bond wedge
• Speed: Highest UPH due to linear motors for bonder and indexer

Central wedge bonder control system

• A central 23″ touch panel is used to monitor and control the bonder and indexing system
• Metal keypad and robust trackball for industrial use
• User-friendly calibration wizard and automatic update of calibration data at bondhead change on all available bondheads

Automotive Module

Quality

• Continuous, real time monitoring of wire deformation, transducer current and frequency within programmable control limits
• Process integrated Quality Control PiQC: detection of further parameters, e.g. friction behavior, by additional sensor system for 100 % quality monitoring in real time (patented); as option
• Remote pull function on PiQC threshold value for optimized cycle time; up to 30 % save on equipment
• Integrated, non destructive pulltest for wire and ribbon

Technical Data

E-Box

Mechatronic bondheads

• Heavy wire and ribbon bondheads for Al, Cu and AlCu:
  • HBK (Frontcut, Backcut); Frequency: 60 kHz*
  • RBK Ribbon (Frontcut); Frequency: 57 kHz*
  • RBK Copper (Frontcut, Backcut); Frequency: 57 kHz*
    alternative frequencies available on request
• Cutting methods: active, passive, air cut (for frontcut)
• Digital ultrasonic generator with PLL (Phase Locked Loop),
  internal frequency resolution <1 Hz; programmable ultrasonic power output
• An intelligent bondhead connecting system with integrated memory stores all calibration data and enables bondhead replacement in a few minutes
• Wire clamp for loop shape control is standard on all bondheads;
  optionally equipped with non destructive pulltest
• Option: Inline pull modules: up to 4 modules per bondhead for a non-destructive pulltest (up to a total of 8 per system)

Wire

• Al, Cu, AlCu: 50 μm – 600 μm** (2 mil – 24 mil)

Ribbon

• Al, Cu, AlCu: 250 µm x 25 µm up to 2000 µm x 400 µm**
  (Cu: 200 µm) (10 mil x 1 mil up to 80 mil x 16 mil)

Loop form functions

• Reproducible loop geometry by wire guide appropriate for the material involved and moving wire buffer
• Constant wire length and loop height
• Mechanically demanding loop geometrics by parameterization and individual wire clamp application
• Individual loop shapes by configurable loop trajectory generator

High speed leadframe indexer

• Strip dimensions :
  100 mm – 280 mm length, 15 mm – 90 mm width,
  max. 3.0 mm down-set
• Substrate types: TO220, SOIC, SO8, SOL8, SOT, SOT23, SC70, power-QFN, QFN, DPAK, DFN, DSO, COB, multi-lead SOP, matrix L/F, flat-boat, programmable pitch etc.
• Index time: 100 ms for typical TO220 device (includes clamping)
• Magazine size: 115 mm – 285 mm length, 20 mm – 100 mm width,
  50 mm – 200 mm height