DESIGNED TO PRODUCE NON-CRITICAL SEMICONDUCTOR PHOTOMASKS FOR DESIGN NODES DOWN TO 130 NM, AND NON-MANHATTAN DESIGNS
The ULTRA specifically addresses the production of mature semiconductor photomasks. It is a qualified tool at a major semiconductor photomask production group. The ULTRA is used to fabricate semiconductor components for the electronics and automotive industries. These include power management, microcontrollers, LED lighting, the internet-of-things (IoT) and MEMS.
The ULTRA is an economical mask writer solution with all the features and functionality required for high throughput, precision and structure uniformity, and extremely accurate alignment. The standard configuration includes all modules (FX Fast mode, SMIF Pod, etc). The ULTRA can produce structure sizes down to 500 nm at write speeds up 580 mm2 per minute, while featuring excellent critical dimension uniformity, image quality, overlay and registration. ULTRA 1 produces masks down to 180 nm nodes. ULTRA 2 will be launched in late 2021 and will target significant improvement in alignment accuracy and exposure quality – aiming at 130 nm design node. ULTRA is a compact system and fits easily into the existing mask shop infrastructure.
Two Models
ULTRA 1 for 180 nm design node; ULTRA 2 for 130 nm design node
High Exposure Quality
Line edge roughness 20 nm; CD uniformity 30 nm; positioning accuracy 40 nm; real-time optical autofocus; custom high numerical aperture (NA) write-lens optimized for laser exposure
High Precision
XY stage fully designed and manufactured by Heidelberg Instruments; full air bearing stage; zero thermal expansion zerodur™ chuck; differential interferometer for position measurement
Precise Second Layer Alignment
Sophisticated correction matrix based on a 2D measurement of the first layer. Compensation of arbitrary local position distortions; 100 nm accuracy
High Throughput
High-speed SLM with high data rate for fast exposure. 150 mm wafer in < 45 minutes
Writing Stability
Closed-loop environmental chamber complies with stringent requirements for semiconductor photomask production; integrated metrology system with flowbox and software corrections compensates for any variations in environmental parameters
Long life-time
Economical high-power DPSS 355 nm laser; 20,000 hours of guaranteed lifetime
Overall Cost of Ownership
Laser power consumption ca. 25.270 EUR/year at 0.2 EUR/kWh, 90% tool operation; other consumables 38.500 EUR/year
Footprint
1.65 m x 2.54 m
| Writing performance | QX mode | FX mode |
| Address grid [nm] | 5 | 10 |
| Line edge roughness [3σ, nm] | 20 | 40 |
| Position accuracy [3σ, nm] | 40 | 100 |
| Overlay [3σ, nm] | 30 | 60 |
| Stitching [3σ, nm] | 20 | 60 |
| 2nd layer alignment [3σ, nm] | 100 | 100 |
| CD uniformity [3σ, nm] | 30 | 60 |
| Minimum feature size [nm] | 500 | 700 |
| Write speed [mm² / min] | 325 | 580 |
| Write time for 6″ x 6″ [min] | 75 | 45 |
| Operation | |
|---|---|
| Protocols, standards | SECS / GEM protocols |
| User interface (software) | SEMI-compliant GUI |
| Maximum write area | 228 x 228 mm² |
| Substrate size | 4″, 5″, 6″, 7″, and 9″ masks |
| System features | |
| Optics | 0.9 NA objective lens; Low-distortion UV optics; Automatic calibration routines |
| Laser | 355 nm high-power solid state laser; Highly economical compared to gas laser |
| Focus system | Real-time optical autofocus |
| Alignment | Camera system; Distortion compensation; Field-by-field alignment |
| Data path | Real-time compression; Scalable hardware concept; Input formats: All standard formats, e.g. GDSII and Jobdeck |
| Spatial Light Modulator | Frequency 350 kHz; Data rate 2.4 GB/s |
| Loader | Automatic mask loader with two independent carrier stations |
| System dimensions | System / Electronic rack |
| Width [mm] | 2730 / 800 |
| Depth [mm] | 1650 / 650 |
| Height [mm] | 2100 / 1800 |
| Weight [kg] | 3400 / 180 |
| Installation requirements | |
| Electrical | 400 VAC ± 5%, 50/60 Hz, 32 A |
| Compressed air | 7 - 10 bar (without oil or other residue) |
Please note
Specifications depend on individual process conditions and may vary according to equipment configuration. Write speed depends on pixel size and write mode. Design and specifications are subject to change without prior notice
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