OPTIMIZED FOR INDUSTRIAL MANUFACTURING, ENSURING HIGH THROUGHPUT AND SEAMLESS PRODUCTION LINE INTEGRATION
The Maskless Aligner MLA300 provides high throughput, simplified workflow and integration with manufacturing execution systems (MES). This tool is used for the production of sensors and sensor ICs, MEMS and microfluidic devices. Other applications include discrete electronic components, analog and digital ICs, ASICs, power electronics, OLED displays and advanced packaging.
The MLA300 achieves the highest optical quality and precision. The standard exposure module achieves min. feature size of 1.5 µm. Writing modes for higher throughput at 4 µm resolution and higher resolution at 1 µm are coming soon. MLA300 features full automation with customizable loading options, software designed for production environments and a patented substrate tracking technology.
The MLA300 reduces production costs and effort by overcoming the requirement for mask procurement, verification and management. Operating costs benefit from a long-lifetime exposure laser (est. 10 years at 24/7 production) and fewer consumables. Modularity enables fast maintenance, replacement or repair. Real-time autofocus compensates substrate warp or corrugations for flawless patterning. Maskless lithography allows per-die pattern corrections and serialization for full tracing of product characteristics, such as sensor calibration.
Direct-write Lithography
No mask-related costs, effort, or security risks
Flexibility
Direct writing in industrial production allows per-die pattern corrections, e.g. to react to distortions or process variations and serialization
Time-saving
Shorter time from prototyping to production. Digital design management replaces conventional mask library
Exposure Quality
Optical compensation of scaling, rotation; patented substrate tracking technology
Dynamic Autofocus
Superior critical dimensions (CD) uniformity on warped or corrugated substrates
Exposure Speed
300 x 300 mm in 19.5 minutes
Full Facility Integration
Customizable automatic loader, substrate chuck including warped substrates, custom workflow “wizards” and interface with manufacturing execution systems (MES)
User-friendly
SEMI-compliant user interface; customized workflow “wizards” for system operators
Low Cost of Ownership
Laser lifetime 10 years at 24/7 operation. Power consumption Eur 11,667 per year at 0.2 Eur/ kWh. Filters and replacement parts 5,400 Euro/year
Automated Loading Module
SEMI-standard BOLTS plane can be configured for open cassettes or Load Ports for FOUP. The number and configuration of ports can be selected and customised for round or rectangular substrates
Exposure Modules
High- throughput write mode with 4 μm resolution available from Q2 2021; high-resolution write mode with 1 μm resolution available from Q3 2021
Manufacturing Execution System (MES)
Integration Customizable workflow “wizards” to start exposure jobs, and integration to a central MES via SECS/GEM or OPC-UA protocols
Backside Alignment
Visual or through-wafer IR backside alignment available with 1 um positioning accuracy
Exposure Wavelengths
High-power diode lasers at 375 nm or 405 nm are available
Service Contracts
Service contract grades for faster on-site support and participation in the spare parts pool
| Writing performance | |
|---|---|
| Minimum lines and spaces [µm] | 2 |
| Minimum feature size [µm] | 1.5 |
| CD uniformity [3σ, nm] | 200 |
| Edge roughness [3σ, nm] | 80 |
| Stitching [3σ, nm | 120 |
| 2nd layer alignment [3σ, nmσ] | 500 |
| Backside alignment [3σ, nm] | 1000 |
| Exposure time per module ( 100 x 100 mm² at 50 mJ/cm² and 405 nm laser wavelength) | 2.75 min |
| Maximum write speed with one module at 405 nm laser wavelength | 4615 mm²/min |
| System features | |
|---|---|
| Light source | Laser wavelength: 375 nm and 405 nm High power diode laser with long life-time |
| Maximum substrate size | 300 x 300 mm² |
| Maximum exposure area | 300 x 300 mm² |
| Substrate thickness | 0.1 - 10 mm |
| Modular environmental chamber | Temperature stability ± 0.1°C |
| Real-time autofocus | Optical and/or pneumatic autofocus |
| Autofocus dynamic range | Up to 150 µm |
| Alignment | Advanced alignment; backside alignment optional |
| Automation | Automatic wafer handling and pre-alignment |
| System dimensions (excluding loader) | |
| Height × width × depth | 1980 mm x 1200 mm x 2310 mm |
| Weight | 2600 kg |
| Installation requirements | |
| Electrical | 400 VAC, 50/60 Hz, 16 A |
Please note
Specifications depend on individual process conditions and may vary according to equipment configuration. Write speed depends on pixel size and write mode. Design and specifications are subject to change without prior notice.
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