FlexDEP Physical Vapour Deposition (PVD)

The flexDEP Physical Vapour Deposition (PVD) system is a modular, flexible, high-vacuum evaporator for metal, dielectrics  and/or organic materials.

The system comes as standard with a Siemens PLC industrial controller for reliable software automation. The deposition control is fully automatic with PID loop control for precise thin film thickness determination.

All materials have been carefully selected and engineered for high vacuum compatibility and minimal outgassing for quick pump down times to high vacuum pressure regimes. 

A large 22" touch screen HMI allows for easy intuitive control of the vacuum and deposition control operation.

All flexDEP systems are engineered and assembled within our Sydney headquarters and backed by market leading 2 year warranty.

Typical applications include  quantum computing, wearable electronics, photovoltaics, MEMs, bio-medical, perovskite solar cells, OLEDs, OPVs, and OFETS. Organic active layers in perovskite solar cells, OLEDs, OPVs, and OFETS.

6" Diameter max or smaller pieces

+/- 5% uniformity across 6" Diameter substrate

<5x10E-7 mbar/Torr (Turbo Pump)

<5x10E-8 mbar/Torr (Cryo Pump)

Resistive Thermal Evaporation

Magnetron Sputtering

E-Beam Evaporation (single or multi-pocket)

Low-Temperature Organic Evaporation

Heating = up to +300C / +500C / +800C

Cooling = down to room temperature / -10C / -150C

Various other heating/cooling ranges available on request

Load Lock (single load or cassette)

Ion Assisted Deposition/Etching

RF/DC substrate bias

Residual Gas Analyser

Cooled vacuum chamber

Chamber bakeout

Glancing Angle Deposition Stage (substrate tilt & rotation)

AS3000 Australian wiring and safety standards

Siemens S7 PLC with safety relays

2 Years

Australia