The PlasmaPro 100 Estrelas platform is designed to give total flexibility for Deep Silicon Etch (DSiE) applications - serving a diverse set of process requirements across the Micro Electro Mechanical Systems (MEMS), Advanced Packaging and Nanotechnology markets. Developed with both the research and production markets in mind, the PlasmaPro 100 Estrelas offers the ultimate in process flexibility.

• Smooth sidewall processes
• High etch cavity etches
• High aspect ratio processes
• Tapered via etches
• Wide range of applications
• Mechanical or electrostatic clamping
• Heated liners
• Improved reproducibility
• Increased mean time between cleans (MTBC)

System Features:

Nano and micro structures can be realised as the hardware has been designed with the ability to run Bosch™ and Cryo etch technologies in the same chamber.

Compatible with 50mm to 200mm substrates - ensures you have the ability to develop devices that can be taken to production using the same chamber hardware

Auto match - Process flexibility

Higher flow MFCs and associated generators - High radical densities

Reduced chamber volume and high throughput pumping - Ensures high gas conductance

Fast-acting close coupled MFCs - Fast control (originally developed for ALD)

Applications:

• Silicon Bosch and cryo-etch processes
• SiO2 and quartz etch