The PlasmaPro 100 range of etch and deposition tools can be fitted with a variety of substrate electrodes, enabling processes over a wide temperature range. They offer a 200mm platform with single wafer and multi-wafer batch capability. The process modules offer excellent uniformity, high throughput and high precision processes.
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Wide temperature range electrode, -150°C to 400°C
- Compatible with all wafer sizes up to 200mm
- Rapid change between wafer sizes
- Low cost of ownership and ease of serviceability
- Compact footprint, flexible layout
- In-situ chamber cleaning and end-pointing
System Features:
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Oxford Instruments’ PlasmaPro 100 process modules offer a 200mm platform with single wafer and multi-wafer batch capability. The process modules offer excellent uniformity, high throughput and high precision processes.
Delivers reactive species to the substrate, with a uniform high conductance path through the chamber - Allows a high gas flow to be used while maintaining low pressure
Variable height electrode - Utilises the 3-dimensional characteristics of the plasma and accommodate substrates up to 10mm thick at optimum height
Wide temperature range electrode (-150°C to +400°C) which can be cooled by liquid nitrogen, a fluid re-circulating chiller or resistively heated - An optional blow out and fluid exchange unit can automate the process of switching modes
A fluid controlled electrode fed by a re-circulating chiller unit - Excellent substrate temperature control
RF powered showerhead with optimised gas delivery - Provides uniform plasma processing with LF/RF switching allowing precise control of film stress
ICP source sizes of 65mm, 180mm, 300mm - Delivers process uniformity up to 200mm wafers
High pumping capacity - Gives wide process pressure window
Wafer clamping with He backside cooling - Optimum wafer temperature control
Upgrades/Accessories
Dry pump N2 standby mode - Saves energy and nitrogen
Gas pod - incorporate extra gas lines and allow greater flexibility
Logviewer software - datalogging software allows realtime graphing and post run analysis
Optical end point detectors - an important tool for achieving optimal process results
Soft pump - allows the slow pumping down of a vacuum chamber
Turbomolecular vacuum pump - offers superior pumping speeds and higher throughput
X20 Control System - delivers a future proof, flexible and reliable tool with increased system ‘intellect’
Advanced Energy Paramount generator - Offering increased reliability and greater plasma stability
Automatic pressure control - This controller ensures very fast and accurate pressure control
Dual CM gauge switching - provides the ability to utilise two differing ranges of capacitance manometer via a single pressure control valve
LN2 autochangeover unit - enables table cooling fluid to be automatically switched between Liquid Nitrogen (LN2) and Chiller Fluid
TEOS liquid level sensing - level sensing is achieved using ultra sonic level sensors fitted to the TEOS canister
Wide temperature range electrode - significant design improvements to increase process performance
Applications:
- III-V etch processes
- Solid State Lasers InP etch
- VCSEL GaAs/AlGaAs etch
- RF device low damage GaN etch
- Silicon Bosch and cryo-etch processes
- Diamond Like Carbon (DLC) deposition
- SiO2 and quartz etch
- Failure analysis dry etch de-processing using the specially-configured PlasmaPro FA tools ranging from packaged chip and die etch through to full 200mm wafer etch
- High quality PECVD of silicon nitride and silicon dioxide for photonics, dielectric layers, passivation and many other uses
- Hard mask deposition and etch for high brightness LED production
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