DFD6450 Fully Automatic Dicing Saw

DISCO

SKU: DFD6450

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Fully automatic dicing saw with parallel dual spindles

Φ200 mm
Parallel dual spindle
Package Singulation

A parallel dual design unique to DISCO

Featuring parallel dual-spindles, DFD6450 inherits the basic concept of the existing model, DFD651, and has been added to the DFD6000 series lineup with superior usability and processing quality. Designed to handle a wide range of dicing and grooving applications, the DFD6450 processes silicon, compound semiconductor wafers, ceramics and other materials used for electronic component applications. In addition, the DFD6450 also processes glass and other materials used for optical component applications.The DFD6450's parallel dual spindle design is unique to DISCO and offers several benefits. As the spindles are supported from the rear of the machine, they are easily accessible from the front for blade changes and other maintenance work. The design also supports specialized applications such as mounting multiple blades on each spindle for package singulation.

Improved usability

The 15-inch LCD touch panel with GUI (Graphical User Interface) allows for easy and intuitive operation. In addition, a spindle shaft-lock feature that automatically secures the spindle axis has been installed to make blade replacement quick and easy. DFD6450 also has a cutting water flow rate control feature, making it possible to set the cutting water flow rate for each set of device data.

Spindle lineup

A range of spindles supports diverse workpieces and applications.

[Standard]
1.0 kW air spindle
(uses 2" blades, rated torque: 0.16 N·m).
[Options]
1.0 kW air spindle with higher torque
(uses 2" blades, rated torque: 0.24 N·m)
2.2 kW air spindle
(uses 3" blades, rated torque: 0.7N·m)

Advanced options

The equipment can have a transformer, UPS, CO₂ injector, or booster pump unit built-in by revising the equipment layout while maintaining an equipment footprint equal to that of the existing model. In addition, an atomizing nozzle mechanism (Japan patent no. 3410385) for the spinner section with high cleaning effect on workpieces and ionizer specifications for preventing electrostatic build up during workpiece transfer can be selected.

DFD6450 Operation flow

Lower arm moves the workpiece from the cassette to the pre-alignment stage. Lower arm moves the workpiece to the chuck table → cutting →
Upper arm moves the workpiece to the spinner table → cleaning and drying →
Lower arm returns the workpiece to the cassette

Specifications

Specification		Unit	1.0 kW	2.2 kW
Max. workpiece size		-	Φ8 inch
X-axis	Cutting range	mm	250
X-axis	Cutting speed	mm/s	0.1 ～ 600
Y1-axis	Cutting range	mm	250
	Index step	mm	0.0001
	Positioning accuracy	mm	Within 0.003/250 (Single error) Within 0.002/5
Y2-axis	Cutting range	mm	30
	Index step	mm	0.0001
	Positioning accuracy	mm	Within 0.002/30
Z-axis	Max. stroke	mm	35.2
	Moving resolution	mm	0.00005
	Repeatability accuracy	mm	0.001
θ-axis	Max. rotating angle	deg	380
Spindle	Rated output	kW	1.0	2.2
	Rated torque	N・m	0.16, 0.24 (higher torque)	0.7
	Rotation speed range	min^-1	6,000 ～ 60,000､ 3,000 ～ 40,000 (higher torque)	3,000 ～ 30,000
Equipment dimensions(W×D×H)		mm	1,120 x 1,500 x 1,600
Equipment weight		kg	Approx. 1,400

*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.