TPT Wire Bonder Installation
Early 2020, Nano Vacuum installed a TPT - HB10 Wire Bonder (Germany) at School of Chemical Engineering, University of New South Wales. The HB10 is a bench top size wire bonder, ideal for laboratories and pilot production lines. One bond head for bonding in ball/wedge or wedge/wedge bonding mode. Only a tool change is necessary. Z-Axis is automatic/motorised.
Easy operation with a TFT touch screen, direct access and simple adjustment of all bond parameters.
This instrument is a new member at the Centre for Advanced Solid and Liquid based Electronics and Optics (CASLEO) and is helping the researchers with their experiments.
Professor Kourosh Kalantar-zadeh, Director of CASLEO and Chief Investigator of the ARC Centre of Excellence FLEET tells us about the experience with HB10: “We are happy with the product. It has worked well with no hiccup. It is relatively easy to use and implement. It is compatible with most of our designs.”
Vist our HB10 product information page https://nanovactech.com/collections/wire-die-bonders/products/hb05-manual-thermosonic-wire-bonder-wedge-ball-bonding
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