Tier 1 semiconductor automotive supplier selects Oxford Instruments Plasma Technology ALE technology for it’s GaN power electronic program.

Tier 1 semiconductor automotive supplier selects Oxford Instruments Plasma Technology ALE technology for it’s GaN power electronic program.

Oxford Instruments Plasma Technology announced today that a leading German semiconductor manufacturer to the automotive industry has selected its PlasmaPro^®100 Cobra^® system for the development of next generation GaN power electronic devices.

 The PlasmaPro100 Cobra system is designed for superior uniformity, high- precision and low-damage process solutions. The production-proven system allows for rapid change between wafer sizes up to 200 mm and the cost of ownership is one of the lowest in the market.

 The PlasmaPro100 Cobra system will be incorporated into the R&D section and will be used for development of GaN power devices. GaN power devices are gaining market share in fast charger applications and offer benefits in Electric Vehicle power management systems.

 We continue to see very encouraging signals in the form of increasingly proactive customer engagement and clear market preparation and positioning activities from significant industry players for the emerging Wide Band Gap power electronic market.

 "Our Atomic Scale Processing etch solution being selected by this world leading manufacturer for their GaN power electronics programme is an important strategic win for Oxford Instruments Plasma Technology" comments Klaas Wisniewski, Plasma Technology’s Strategic Business Development Director, who also added: "The GaN based power electronic market is very dynamic with improvements to both performance and cost expected at each design iteration.. This reiterates the importance of our strategy to focus on atomic scale processing solutions such as atomic layer deposition (ALD) and atomic layer etching (ALE).  We are pleased that such a leading automotive semiconductor company recognizes the benefits our solutions deliver.