Plasma technology in 3D printing
Predefining joint geometries with maximum bonding area and the gluing pose challenges in 3D printing for large components. For long narrow joints with small bonding surface the strength of bond is essential. plasma technology of our partner, relyon plasma GmbH, is helping industries to overcome this weakness by fine cleaning of the surface from organic contaminants and increasing surface energy for an improved wettability by adhesives.
How piezobrush® PZ2 Improved bonding through plasma activation?
The Creabis GmbH is applying piezobrush® PZ2 in the processing of 3D printed parts
1. The interior door trim of an innovative small series electric vehicle of a German start-up is printed by Creabis from unfilled PA12 by selective laser sintering in four individual parts. Which are then activated with cold plasma and spotted with cyanoacrylate superglue. About an hour later while the parts are still activated, they are structurally bonded with two-component adhesive. Dipl. Phys. Ralf Deuke, owner of Creabis GmbH, sees the use of plasma technology as extremely advantageous: “The use of the piezobrush® PZ2 now opens up possibilities for bonding individual parts that were previously unthinkable”.
2. The second example is in which a motorbike fairing for racing is made from 12 individual parts using 3D printing and then glued after pre-treatment with the piezobrush PZ2. Due to the adhesive strength achieved, the fairing installed on the motorcycle can even withstand speeds of over 200 km/h. Internal tests reveal that the components treated with plasma technology have an adhesive bond that is three times stronger than that of untreated parts.
Read the full text here by relyon plasma GmbH.
Explore more
- 2D Material
- 2D materials
- 3D
- 3D printing
- 7th South Australia Space Forum
- adhesion
- adhesive bonding
- Aerospace
- AFM
- ALD
- angle etch
- Apiezon
- ATC
- atomfab
- atomic force microscopy
- battery
- benchtop
- Benchtop PVD Deposition System
- Benchtop Thermal Evaporation
- Biocompatibility
- bonding
- bone differentiation
- Bosch Etcher
- cell adhesion
- Characterisation
- Chemical etch
- Chiller
- CMOS
- CMP
- Coating
- cold atmospheric pressure plasma
- Communicator
- Covid-19
- CRYO Instruments
- Cubesat
- Data Analysis
- Deep Silicon Etch
- Dental
- Deposition
- direct imager
- Direct Write Lithography
- direct writing
- directwrite
- dope
- Dry Etcher
- dry etching
- Edwards Vacuum
- Electrical characterisation
- electron microscopes
- electronic devices
- energy harvesting devices
- Etch Process
- Etch Slanted Features
- etching
- Europlasma
- Evaporation
- FlexAL
- Fluxim
- Gas
- Glovebox
- Graphene
- Grease
- HDPE
- Health Centre
- heat exchangers
- Heidelberg Instruments
- heterostructures
- Holograms
- hydrophilicity
- ICP
- ICPMS
- innovation
- installation
- Ion Beam
- Ion beam etching
- ISO9001
- iVacSens
- Lab On Chip
- lithography
- lithography system
- magnetron
- Maskless Aligner
- Maskless Lithography
- maskless stepper
- masklessaligner
- memories
- MEMS
- MEMs Vacuum Sealer
- microfabrication
- Microfuidics
- Microstructures
- MLA150
- MoS2 Monolayer
- Nano technology
- Nano Vacuum
- nano-oscillators
- nanofabrication
- nanofluidics
- nanofrazor
- nanotechnology
- Nanovac AB
- nanovacuum
- navigation
- Nazia Tabassum
- Nnao Vacuum
- NnaoFrazor
- nomoremasks
- NT-MDT
- Oil
- Oncology
- OpAL
- Optical
- optics
- optoelectronics
- Oxford
- Oxford Instrument
- Oxford Instrument Nano Science
- Oxford Instruments
- Oxford Instruments Nano Science
- Oxford Instruments Plasma Technology
- p-n junction
- pattern
- pattern generator
- patterning
- Perovskite Solar Cells
- Perovskites
- photonics
- photovoltaic
- Physical etch
- Piezobrush
- Plasma
- Plasma Cleaner
- Plasma etch
- Plasma Polish
- Plasma Pro 100 Estrelas
- plasma process
- Plasma technology
- plasma treatment
- Plasmaguard
- PlasmaPro
- plastics
- polarity
- Power Device
- Precision Hot Plates
- Pressure
- Process News
- PTIQ software
- PVD
- PZ3
- quantum
- Quantum Device
- Quantum Devices
- quantum dots
- Quantum technology
- Raman
- Rapid Thermal Annealers
- Recirculating Chillers
- Relocation
- Relyon
- Relyon Plasma
- Replace Mask Aligner
- Rotor Gauge
- RTA
- RTP
- scanning probe microscopy
- semiconductor
- SENS4
- SENS4 A/S
- sensor
- sensors
- shear test
- Si deformation
- SiC
- slanted etching
- slanted features
- SmartPirani
- Software
- solar cells
- Solder Reflow Ovens
- Space Mission
- Space research
- Space Simulation
- Specs
- Spectroscopy
- Spintronic
- Sputtering System
- SRG
- start ups
- superconducting qubits
- superconducting single photon detectors
- surface energy
- surface science
- surface treatment
- The ProteoxTM
- Thermal Vacuum Chamber
- thermochemical scanning probe lithography
- thin film deposition
- tHz time-domain
- Titanium
- TPT Wire Bonder
- Transducer
- TVAC
- UniTemp GmbH
- UNSW
- Vacuum
- Vacuum Pumps
- VSS-300 Vacuum Solder System
- Walk Through Booth
- Wax
- webinar
- wettability
- wire bonding
- X-ray