- Spin & spray coater, developer, temperature and smartEBR modules are available as stand-alone, table-top or bench mounted configurations.
- Base frame design allows various process modules configurations.
- Round wafer up to Ø300 mm (Ø12 inch)
- Square substrate size up to 230 x 230 mm (9 x 9 inch)
The product range also offers customized single processing systems for large substrates up to 1.300 x 1.300 mm (51 x 51 inch). Optional sub-systems; PR dispense systems (pumps, syringe or CPD).
HOTPLATES Designed to be used in applications: SOFTBAKE (PRE-BAKE), HARDBAKE, OPTIONAL FOR HMDS (HEXAMETHYLDISILAZANE): VAPOR PRIMING, VACUUM DRYING
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