Benefits and Features
Advanced features and process advantages
- Full integration of tool temperature in the process parameters and bonding programms
- All features of a Heavy Wire Bonder BJ959 with same footprint
- Improved wire guidance: short distance between bondhead and spool
- Optimized pattern recognition
- Automated bondtool change without wedge gauge
- Precisely programmable bondforce actuator
- Loop generator for individual loops
- Maintenance-free solid state joints
- Pre-setting of bondheads via EEPROM
- Hesse Assist Tools (option): :
- E-Box: patented solution for optimized tool change and programmable alignment marks for cutter, wire guide and bond wedge
- Automated bondforce calibration; a load cell prevents operator error and ensures robust processes
- Innovative bondtool detection
- Wire spool detection
Flexibility
- Working area
- LSB959: 370 mm x 560 mm
- Flexible use of the large working area, e.g. vacuum clamping of several 5″ x 7″ standard DCBs by vacuum workholder sixfold
- Maximization of throughput by automation (two/more parallel lanes
- Safe operation: Laser class 1
- Two processes on one plattform: classic ultrasonic heavy wire bonding and thermosonic heavy wire bonding
Quality
- Continuous real time monitoring of wire deformation, transducer current, and frequency, bond tool temperature within programmable control limits
- Process integrated Quality Control PiQC: detection of further parameters, e.g. friction behavior, by additional sensor system for 100 % quality monitoring in real time (patented); as option
Integrated, non-destructive pulltest
Remote pull function on PiQC threshold value for optimized cycle time; > 99% savings in quality check compared with single NDPT (non destructive pull test)
Thermosonic-Function
- Heavy wire bondhead with thermosonic function
- Laser-heated bondtool tip with controlled laser absorption
- Fast local heat transport into wire and substrate
- Temperature: Bondtool tip at 400-500 °C for interface at 150-200 °C
- No thermal effects on transducer
- Accurate laser setting due to pilot laser
- Inert gas noozle (e.g. nitrogen) prevents Cu oxidation during bonding process (option)
- Precisely controlled bondtool temperature
- Intelligent bondhead connecting system with integrated memory stores all calibration data and enables bondhead replacement in minutes
- Wire clamp for loop shape control is standard on all bondheads; optionally equipped with non destructive pulltest
Technical Data
Working area
- LSB959: X: 370 mm; Y: 560 mm; Z: 42 mm
- P-rotation: 440°
Thermsonic bondhead
- LSK (Backcut): Laser-heated bondtool tip with controlled laser
absorption - Temperature: Bondtool tip at 400-500 °C for interface at 150-200 °C
- Frequency: 60 kHz*; alternative frequencies on request
Cutting methods
- active, passive
Wire
- Cu: 300 μm – 500 μm**
Ultrasonic
- Digital ultrasonic generator with PLL (Phase Locked Loop),
internal frequency resolution <1 Hz - Programmable ultrasonic power output
Laser
- IR fiber laser with power up to 130W
- Programmable temperature output
Footprint and weight
- LSB959: 805 mm x 1634 mm x 1912 mm, approx. 1300 kg
Various loop form functions
- Reproducible loop geometry by wire guide appropriate for the material involved and moving wire buffer
- Constant wire length and loop height
- Mechanically demanding loop geometrics by parameterization and individual wire clamp application
- Individual loop shapes by configurable loop trajectory generator
* exact range of frequencies on request
** other sizes on request
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