Achieves high productivity for sapphire, lithium tantalate, and MEMS processing
- Φ200 mm
- Stealth Dicing™
- SDBG
- SDTT
- DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide used in applications such as LED sapphire substrates and silicon microphones.
- Stealth Dicing™ process makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.
- This is a completely dry process, making it suitable for processing devices such as MEMS that are susceptible to water damage.
Height adjustment function
Stealth Dicing™ process can be performed based on the wafer surface height, making it possible to reliably process wafers with significant warpage.
Wafer shape recognition
Wafer shape is measured using a high-resolution sensor to singulate at the optimal processing area.
Compatibility with various materials
High-quality processing can be achieved for sapphire, SiC, and GaAs using laser oscillators suited for each material.
DISCO is an alliance partner* of Hamamatsu Photonics, which owns the portfolio of patents for Stealth Dicing technology.
*System integrators who are business partners with comprehensive licensing for the portfolio of patents for Hamamatsu Stealth Dicing technology.
https://www.hamamatsu.com/jp/en/product/semiconductor-manufacturing-support-systems/stealth-dicing-technology/alliance-partners.html
Specifications
| Specification | Unit | ||
|---|---|---|---|
| Processing method | - | Stealth Dicing™ | |
| Max. workpiece size | mm | Φ200 | |
| X-axis (Chuck table) |
Processing range | mm | 210 |
| Moving speed | mm/s | 1 ～ 1,000 | |
| Y-axis (Chuck table) |
Processing range | mm | 210 |
| Index step | mm | 0.0001 | |
| Positioning accuracy | mm | 0.003/210 (Single error)0.002/5 |
|
| Z-axis | Moving resolution | mm | 0.0001 |
| Repeatability accuracy | mm | 0.001 | |
| θ-axis (Chuck table) |
Max. rotating angle | deg | 380 |
| Equipment dimensions (W×D×H) | mm | 950 × 1,732 × 1,800 | |
| Equipment weight | kg | Approx. 1,800 | |
*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.
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