The n.jet semicon series offers a wide range of processes for frontend, as well as backend processes in the semiconductor industry. The platform comes with integrated edge handling for any substrate type or wafer size, integration with the MES system (e.g., SECS-GEM), and state-of-the-art pre- and post-processing modules.

Our nozzle replacement strategies and our full process control improve yield and process stability. The system can be combined with high-precision dispensing units that further enlarge the window of processable materials within the same platform.

 Applications:

• Photo resist printing
• Deposition of sensor active inks
• Chip packaging
• Printing of dielectrics, conductives, resists, adhesives

Main features

• High precision inkjet printing
• Drop placement accuracy of better than 5 micron
• High uniformity
• Up to 8 different fluids in one print
• Supports printheads from all major manufacturers 

Usability & Maintenance

The n.jet semicon platform features solutions for a large variety of applications. Our print strategies increase platform usability and process yield by minimizing the need for manual intervention or manual mechanical alignment of the printheads.

Our field proven advanced printhead maintenance system increases platform uptime. No direct contact to the printhead nozzle plate results in higher jetting stability and longer printhead lifetime. Our automated nozzle calibration and advanced nozzle replacement strategies provide you with full process control and reliable results.