Lasersonic Wire Bonder LSB959

Benefits and Features

Advanced features and process advantages

• Full integration of tool temperature in the process parameters and bonding programms
• All features of a Heavy Wire Bonder BJ959 with same footprint
  • Improved wire guidance: short distance between bondhead and spool
  • Optimized pattern recognition
  • Automated bondtool change without wedge gauge
  • Precisely programmable bondforce actuator
  • Loop generator for individual loops
  • Maintenance-free solid state joints
  • Pre-setting of bondheads via EEPROM
  • Hesse Assist Tools (option): :
    • E-Box: patented solution for optimized tool change and programmable alignment marks for cutter, wire guide and bond wedge
    • Automated bondforce calibration; a load cell prevents operator error and ensures robust processes
    • Innovative bondtool detection
    • Wire spool detection

Flexibility

• Working area
  • LSB959: 370 mm x 560 mm
• Flexible use of the large working area, e.g. vacuum clamping of several 5″ x 7″ standard DCBs by vacuum workholder sixfold
• Maximization of throughput by automation (two/more parallel lanes
• Safe operation: Laser class 1
• Two processes on one plattform: classic ultrasonic heavy wire bonding and thermosonic heavy wire bonding

Quality

• Continuous real time monitoring of wire deformation, transducer current, and frequency, bond tool temperature within programmable control limits
• Process integrated Quality Control PiQC: detection of further parameters, e.g. friction behavior, by additional sensor system for 100 % quality monitoring in real time (patented); as option
  Integrated, non-destructive pulltest
  Remote pull function on PiQC threshold value for optimized cycle time; > 99% savings in quality check compared with single NDPT (non destructive pull test)

Thermosonic-Function

• Heavy wire bondhead with thermosonic function
• Laser-heated bondtool tip with controlled laser absorption
• Fast local heat transport into wire and substrate
• Temperature: Bondtool tip at 400-500 °C for interface at 150-200 °C
• No thermal effects on transducer
• Accurate laser setting due to pilot laser
• Inert gas noozle (e.g. nitrogen) prevents Cu oxidation during bonding process (option)
• Precisely controlled bondtool temperature
• Intelligent bondhead connecting system with integrated memory stores all calibration data and enables bondhead replacement in minutes
• Wire clamp for loop shape control is standard on all bondheads; optionally equipped with non destructive pulltest

Technical Data

Working area

• LSB959: X: 370 mm; Y: 560 mm; Z: 42 mm
• P-rotation: 440°

Thermsonic bondhead

• LSK (Backcut): Laser-heated bondtool tip with controlled laser
  absorption
• Temperature: Bondtool tip at 400-500 °C for interface at 150-200 °C
• Frequency: 60 kHz*; alternative frequencies on request

Cutting methods

• active, passive

Wire

• Cu: 300 μm – 500 μm**

Ultrasonic

• Digital ultrasonic generator with PLL (Phase Locked Loop),
  internal frequency resolution <1 Hz
• Programmable ultrasonic power output

Laser

• IR fiber laser with power up to 130W
• Programmable temperature output

Footprint and weight

• LSB959: 805 mm x 1634 mm x 1912 mm, approx. 1300 kg

Various loop form functions

• Reproducible loop geometry by wire guide appropriate for the material involved and moving wire buffer
• Constant wire length and loop height
• Mechanically demanding loop geometrics by parameterization and individual wire clamp application
• Individual loop shapes by configurable loop trajectory generator

* exact range of frequencies on request

** other sizes on request