Reflow Solder Systems
8 products
Reflow Solder Systems are used in reflow solder processes (flux or fluxless) for R&D, prototyping and small series production.
The reflow solder system is perfect for the following applications:
- flux-less soldering
- flip chip process
- adhesive bonding
- solder bump reflowing
- encapsulation of housings
- soldering of power devices
- heat treatment of semiconductor wafers
- prototype development
- quality control
We offer a wide range of reflow solder systems:
- RSO: Reflow Solder Oven RSO-200 (up to 650 °C)
- RSS: Mini Reflow Solder System RSS-110-S, RSS-160-S, RSS-210-S (max. temp. 400 °C)
- RVS-210: Reflow Vacuum Solder System up to 400 °C also for flux
- VSS: Vacuum Solder System (up to 400 °C) also for flux
8 products
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