Tilting Spindle Wafer Dicing Saw

ADT SKU: TILT-SPINDLE
Tilting Spindle Wafer Dicing Saw - Nano Vacuum Australia & New Zealand
Tilting Spindle Wafer Dicing Saw - Nano Vacuum Australia & New Zealand
Tilting Spindle Wafer Dicing Saw - Nano Vacuum Australia & New Zealand
Tilting Spindle Wafer Dicing Saw - Nano Vacuum Australia & New Zealand

Tilting Spindle Wafer Dicing Saw

ADT SKU: TILT-SPINDLE
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Advanced Dicing Technologies (ADT) specializes in the development and manufacturing of systems, blades and processes used in the dicing of silicon-based ICs, Package Singulation and hard material Microelectronic Components (MEC).

ADT offers dicing equipment with a variety of capabilities, configurations and levels of automation, as well as peripheral instrumentation and accessories, to suit an ever-growing range of customer requirements. Combining our equipment, dicing blades and process know-how we bring our customers comprehensive dicing solutions.

Many optoelectronic components utilize 8° angular surfaces to eliminate back-reflection at connection or termination points. For the benefit of manufacturers who rely on costly and time-consuming grinding techniques to produce these angled surfaces, ADT has come up with an alternative.
The Tilting Spindle capability of the 71TS Model is designed to allow perpendicular cutting of optoelectronic materials and can be quickly and easily adjusted to dicing at angles between 0° and 15°. Fine adjustment of the spindle angle, along with blades, dicing parameters, and other inclusive process options developed specifically for your component type, guarantee precise angular cuts and excellent surface finish. Customers have found that these cuts are of a quality sufficient to reduce, if not completely eliminate, the need for separate polishing operations.

 Features & Benefits

  •  Quick changeover from perpendicular (0°) to any angle up to 15° 
  •  Permits angular dicing of:

Planar Wave Guides 

  • Si, Silica-on-Silicon 
  • Polymers on Si
  • InP 
  • GaAs

Fiber Wave Guides       

  • LiNbO3
  • Fused Silica
  • Dedicated programmable work stations for both angular settings 
  • Field fine adjustment capability 
  • 0.1° angular repeatability 
  • 0.1° angular resolution

Spindle adjustment takes no more than a few minutes and requires no special setup or reprogramming when switching to a different cutting angle.

The shaded area in (A) represents the amount of material to be removed by grinding and polishing after a pependicular cut. An angular cut is shown in (B).

The 8° angular cut is used to supress back-reflection in many optoelectronic components.

An angular 8° cut accomplished with a tilting spindle system.

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