7120/7130 Wafer Dicing Saws
Advanced Dicing Technologies (ADT) specializes in the development and manufacturing of systems, blades and processes used in the dicing of silicon-based ICs, Package Singulation and hard material Microelectronic Components (MEC).
ADT offers dicing equipment with a variety of capabilities, configurations and levels of automation, as well as peripheral instrumentation and accessories, to suit an ever-growing range of customer requirements. Combining our equipment, dicing blades and process know-how we bring our customers comprehensive dicing solutions.
The 712x/713x families of 2” and 4” spindle dicing systems deliver a high level of affordability and flexibility. With multiple models to choose from, the 712x/713x Series covers the widest range of applications, offering the lowest Cost-of-Ownership while providing the most advanced dicing technology available:
- Ceramic Substrates & Capacitors
- Automotive Sensors
- Glass on Silicon
- Package Singulation (BGA, QFN)
- SAW Filters
- LTCC
- Glass
- PZT
- LED & LED on PCB Packages
- Opto-electronic Components
- Sensors & MEMS
- IC Wafers
ADVANTAGE
- 2” and 4” spindle dicing systems
- A full range of automatic vision capabilities
- Advanced hardware platform for high reliability and low maintenance
- Heavy Duty, cast-iron base structure for superior precision and accuracy
- Increased yield, throughput and process control
- Unique multi-panel processing capabilities
- Special blade wear forecast algorithm
- User-friendly software platform
FEATURE
- Extra Large Area Dicing (7100 XLA)
- Large Area
- Tilting Spindle
- Dressing Station for diamonds exposure and clogging prevention
OPTIONS
- Dicing Floor Management (DFM):
- Transparency & real time visibility of the production floor
- Progressive production monitoring
- Monitoring the production efficiency
- Tracking operator performances
- Increasing productivity
- Increased reliability and quality
- Easy to file reports (daily, weekly and monthly)
- Blade inventory management
- Recipe backups
- Capability to transfer recipe between the systems
- Hexagonal Measuring Software Feature
- Large Dress Station
- Customization
Download brochure here
SPECIFICATION
| Model | 7122 | 7132 | 7124 | 7134 |
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Workpiece Size up to (mm) |
200X200 | 300X300 | 200X200 | 300X300 |
| Spindle | Air-bearing, DC-Brushless 60,000 rpm /1.2 KW | Air-bearing, DC-Brushless 30,000 rpm /2.5 KW | ||
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High Power (optional) 60,000 rpm / 2.4 KW |
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| Blade Size | 2" - 3" | 4" - 5 | ||
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Y Axis
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Ball bearing lead screw with stepper motor
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X Axis
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Air slide
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Z Axis
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Ø Axis
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| Vision System | Digital camera, High bright LED illumination (vertical and oblique) Continuous digital magnification from X55 to X210 or from X35 to X140 (optional) |
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Utilities
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| Dimensions (WxDxH) | 965 x 1,300 x 1,600 mm | |||
| Weight | 900 kg | |||
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Environmental
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Model 7122:
- Silicon wafers
- Thin-film devices
- High-brightness LED Packages
- SAW Filters
- Glass/Silicon Sensors
- PZT and more
Model 7132:
- PCB, QFN and BGA Panels
- High-brightness LED Packages
- 12” and 8” Silicon Wafers
- SAW Filters
Model 7124:
- Ceramic substrates
- Alumina
- Hybrids
- Thick film devices and more
Model 7134:
- Ceramic substrates
- Alumina
- Hybrids
- Thick film devices and more