Medical Device Wafer Dicing Saw

ADT SKU: Medical-Saw
Medical Device Wafer Dicing Saw

Medical Device Wafer Dicing Saw

ADT SKU: Medical-Saw
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Advanced Dicing Technologies (ADT) specializes in the development and manufacturing of systems, blades and processes used in the dicing of silicon-based ICs, Package Singulation and hard material Microelectronic Components (MEC).

ADT offers dicing equipment with a variety of capabilities, configurations and levels of automation, as well as peripheral instrumentation and accessories, to suit an ever-growing range of customer requirements. Combining our equipment, dicing blades and process know-how we bring our customers comprehensive dicing solutions.

The 71MD dicing saw system is designed for a demanding and tight application such as PZT.

The system is equipped with Height on parts measuring system and it can be provided with large Z clearance in order to support thick jig's.

Z linear encoder is equipped with the 71MD machine for best cut depth accuracy. It can be supplied with spindle balancing system for minimizing the spindle vibration. 
Typical applications for Ultra-Sound sensors. 

Features & Benefits

  • Low-vibration spindle supported by new and advanced vibration monitoring features
  • Height measurement capabilities including “height-on-part”
  • Z linear Encoder with error mapping to enhance cut depth accuracy
  • Integrated balancing software for better calibration and stability
  • PZT Wall Thickness Measurement

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